PEMTRON
EAGLE 3D 8800

Through Hole 3D AOI System Bottom
Side Head 3D AOI
▶ Bottom Camera Head Gantry
▶ Simultaneous Inspection Algorithm (2D and 3D)
▶ Telecentric Lens offers Higher Detection Accuracy
▶ High-Speed CPU & Image Processing
▶ User-Friendly GUI
▶ Built in Library Management System
▶ Offline Real-Time Debug Station

3D Measurements Free from Shadows and Reflections
-The EAGLE 3D 8800 AOI uses 8-way projection for 3D measurements on all models to minimize
errors due to shadow effects, and performs 100% 2D & 3D concurrently in all FOV areas.
-This significantly reduces the false call while providing near-perfect detection.

Accurate and convenient inspection using side camera
Four high-definition cameras on the side and a dedicated algorithm optimized for both use and
side inspection is available for real-time inspection.

-4-Way Side Camera (Optional)
-Internal bridge detection not found in Top Camera
-Connector internal detectable
-Convenient Teaching Using Existing Algorithm

27mm high part 3D measurement/inspection
EAGLE 3D AOI offers the option of inspecting up to 30mm in height components with a unique PEMTRON technology.

Clever system engineering: efficient and sustainable
The CondensoXC is a space-saving, powerful system for laboratory applications, small series production and prototyping. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provides optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.

CondensoXC loading concept
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading

Manual front loading
The CondensoXC is manually loaded with pre-assembled product carriers from the front on the operator’s side. In this way, the assemblies can be easily placed on and removed from the interchangeable product carriers. The product carrier is on a rail system to ensure full access to the working area. Assemblies up to 500 x 540mm (W x L) can be placed on the product carriers.

Gentle cooling
After the soldering process, the assembly is cooled to the desired temperature using convection. The bulkhead of the cooling zone is then opened automatically, and the product carrier can be withdrawn on a rail for easy unloading.

- Manual loading axis (Batch System)
- Manual loading of the process chamber via drawer with carrier
- Vacuum Package
- Air cooling section
- Basic workpiece carrier
- Basic color: SN 700 light basic
- Frame color: RAL 7015 slate grey
- VisuII 7.3.x with Windows 10 Enterprise LTSC

The DECAN series models can handle a wide range of components
and maximize productivity with various PCB transfer systems.

· Secures the applicability to components and conveyor flexibility.
· Reduces production time by optimizing the motion sequence.
· Reinforces odd-shape component recognition by applying 3D lighting system

Features

Productivity

Dual Lane PCB Transfer System
Realizes zero PCB loading/unloading time by loading the PCB on the opposite lane and having it stand by during operation (productivity increases by 15% compared to a single lane)


Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Allows optimum combination of conveyor modules by applying a modular conveyor replaceable on site (Shuttle ↔ Dual).


High Reliability

Prevents Reverse Insertion by Recognizing the Polarity Mark at the Bottom Surface of a Component
Recognizes the polarity mark at the bottom surface of a component using the 3-stepped 3D lighting.

Stage Camera 1EA is included

High Performance

Productivity Improvement
Increases the speed and accuracy for placing microchips (03015) Applies dual-lane PCB transfer system (productivity increases by 15% compared to a single lane)
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High Reliability

Adopts a Linear Motor to Realize Low Noise and Vibration
Applies the twin servo control and linear motor to the Y-axis to realize low noise and vibration.

Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Possible to produce various models depending on the Modular Conveyor System replaceable on site.

Easy Operation

Reinforces the Convenience of Machine Software Operation
The built-in optimization software allows a PCB program to be easily created and edited.

The DECAN series models can handle a wide range of components
and maximize productivity with various PCB transfer systems.

· Secures the applicability to components and conveyor flexibility.
· Reduces production time by optimizing the motion sequence.
· Reinforces odd-shape component recognition by applying 3D lighting system

Features

Productivity

Dual Lane PCB Transfer System
Realizes zero PCB loading/unloading time by loading the PCB on the opposite lane and having it stand by during operation (productivity increases by 15% compared to a single lane)


Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Allows optimum combination of conveyor modules by applying a modular conveyor replaceable on site (Shuttle ↔ Dual).


High Reliability

Prevents Reverse Insertion by Recognizing the Polarity Mark at the Bottom Surface of a Component
Recognizes the polarity mark at the bottom surface of a component using the 3-stepped 3D lighting.

Multi-Functional Place

SM series models are the best selling products and have been proven by many customers worldwide.

·Adopts high-pixel vision system allowing accurate placement of IC components.
·Easily registers complex shapes of components with the Polygon function.

Features :

Reliability

Adopts Powerful Camera Algorithm
Improves recognition accuracy with the component image noise removal function and automatic teaching function of components Corrects the pickup position of components such as Chip, TR, BGA and QFP automatically in real time

Easy Operation

Polygon Recognition Algorithm
Allows even the components of a complicated shape to be easily registered by extracting the component shape and recognizing it entirely.

Easy Operation

Multi-Vendor Component Management Function
When the same components are supplied from different component supply devices, allows them to be used without changing a PCB file and downloading it again.

SATURN

3D Inline Solder Paste Inspection system
PEMTRON's 3D Inline Solder Paste Inspection System using
Moiré pattern combines 2D color images with 3D measurement
data to provide more accurate and realistic 3D inspection
image unlike the conventional method that displayed solder
paste through a color map only.

▶ Industry-leading precision and reliability of inspection
- Eliminate shadow using Multi Projection
▶ Real Color Full 3D Imaging Technique
▶ Glue inspection greater than 2mm
▶ Perform 2D & 3D algorithms simultaneously
▶ 64 bit Windows 10 Operating System
▶ Linear Motor Gantry Type Drive
- High-speed precision control improves repeatability
- Reduction of noise/vibrationd
Single Large Model: 510x510mm
Camera: 10MP
Resolution: 15um
Options included:
* Internal Barcode Licence 1D
* Internal Barcode Licence 2D
* Auto program change over (in combination with external reader)
* Offline Editor SPI
* Verification SW
* SPC Server/Client SW
* 3D Calibration Jig SPI

Non-Stop Selective Soldering Delivers Results
Choose from the Synchro 3, 5, or 5 XL, offering three or five soldering stations. All Synchro systems process several boards simultaneously, in various quantities, using different alloys and nozzles or a single fixed nozzle size. The system configuration includes a Microdrop drop-jet fluxer and can accommodate multiple solder nozzles to apply lead-free and leaded alloys.

The SELECT Synchro:
• Fast. Boards continuously travel through the system, boosting throughput by 20-40% for most applications, with more gain possible if conveyance and soldering times are comparable.
• Easy to use. Automatically balances soldering work between soldering pots for increased throughput.
• Compact. Due to the minimal pot and fluxer motion in the conveyor direction, all Synchro systems reduce the system footprint, with the Synchro 5 reducing footprint by as much as 60% compared to traditional multi-station systems.
• Flexible.Depending on the system, supports up to three or five solder pots, each with the ability to accommodate different nozzle sizes, eliminating the need to change nozzles.
• Dependable.. Forms reliable solder joints without overheating neighboring components to protect product performance.

Choose a System Package:
• Essential – The Synchro 3 and 5 systems offer non-stop selective soldering productivity for 2500 mm x 460 mm boards.
• Large-Scale – The Synchro 5 XL system offers non-stop selective soldering productivity for 2500 mm x 680 mm boards.

Base model includes:
• Three solder pots (Synchro 3).
• Five solder pots (Synchro 5).
• Independent areas for concurrent fluxing, preheating, and soldering.
• SMEMA compatible with positive board location.
• Automatic conveyor-width adjustment.
• MicroDrop drop-jet fluxer.
• Flux-level sensing.
• Top and bottom heaters.
• Full titanium solder pot and pump assembly.
• Quick-change magnetically coupled solder nozzle.
• SolderWorks Editor software for easy point-and-click programming.

The Integra® 508.3 selective soldering system is ideal for high-volume production.

High Volume, Maximum Productivity
The multi-station, two-solder-pot Integra 508.3 combines fluxing, pre-heating, and soldering to increase throughput and reduce cycle time significantly.
Receive your essential selective soldering system with minimal lead time.

The Integra 508.3:
• Flexibility. The two-segment configuration can solder two boards in-line with two segmented conveyors without the boards being panelized or requiring tooling.
• Parallel processing. In-line parallel processing significantly increases throughput.
• Simple maintenance. Full titanium solder pots compatible with all solder alloys plus easy tool-free maintenance.

Essential System Capabilities
• Productivity – With two solder pots, a MicroDrop drop-jet fluxer, extensive pre-heat capabilities, two solder pots, and two-segment in-line parallel processing, the Integra 508.3 is essential for advanced productivity.

Base model includes:
• MicroDrop drop-jet fluxer.
• Flux-level sensing system.
• Two solder pots.
• Nozzle width measuring.
• Parallel soldering capabilities for panelized and non-panelized boards.
• Small and large nozzle soldering capabilities for boards up to 700 x 508 mm.
• SMEMA conveyor with positive board location.
• All titanium solder pot and pump assembly.
• Quick-change magnetically-coupled solder nozzles.
• SolderWorks Editor and machine control software.

The Integra® 508.4 selective soldering system is ideal for high-volume production.
High Volume, Maximum Productivity
The multi-station, four-solder-pot Integra 508.4 combines fluxing, pre-heating, and soldering to increase throughput and reduce cycle time significantly.
Receive your essential selective soldering system with minimal lead time.

The Integra 508.4:
• Flexibility. The two-segment configuration can solder two boards in-line with two segmented conveyors without the boards being panelized or requiring tooling.
• Parallel processing. In-line parallel processing significantly increases throughput.
• Simple maintenance. Full titanium solder pots compatible with all solder alloys plus easy tool-free maintenance.

Essential System Capabilities
• Productivity Plus – With four solder pots, a MicroDrop drop-jet fluxer, extensive pre-heat capabilities, and two-segment in-line parallel processing, the Integra 508.4 takes advanced productivity to the next level.

Base model includes:
• MicroDrop drop-jet fluxer.
• Flux-level sensing system.
• Four solder pots.
• Nozzle width measuring.
• Parallel soldering capabilities for panelized and non-panelized boards.
• Small and large nozzle soldering capabilities for boards up to 700 x 508 mm.
• SMEMA conveyor with positive board location.
• All titanium solder pot and pump assembly.
• Quick-change magnetically-coupled solder nozzles.
• SolderWorks Editor and machine control software.

The 3-in-1 solution for your soldering process.
Vision TripleX: a patented new development in the field of convection and vapor phase soldering. The system is based on the reflow convection soldering systems in the Vision series and combines the convection soldering process with the proven vapor phase soldering process of the Condenso series. Thus, three processes can be carried out in the Vision TripleX: reflow convection soldering with and without vacuum and vapor phase soldering using Galden®. This provides uniquely flexible manufacturing options.

Vacuum chamber
Vacuum soldering is one of the three soldering processes integrated in the Vision TripleX. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Active Galden® filtering
After soldering, the assembly is passed onto the cooling process. Process gas is extracted and cleaned at the same time. Therefore, a large part of the Galden® can be reused, a solution that is particularly material-friendly and environmentally friendly! A vacuum is created during extraction which also ensures that soldering material is dried quickly.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the Vision TripleX has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

Energy-efficient system facilitates low-maintenance manufacturing
The VisionXP+ is our "best in class" reflow convection soldering system, which is clearly in line with the trend towards the sustainable management of resources. With a particular focus on energy efficiency, reducing emissions and operating costs, EC motors were integrated into the VisionXP+ and these enable you to save on energy in a provable manner. The option of carrying out vacuum soldering enables you to create a time-efficient and stable production procedure, as well as to reduce voids, in order to ensure low-maintenance manufacturing. With the VisionXP+, you have various options available to you for gentle cooling, including underside cooling. With this, especially high-mass boards in particular can be cooled easily.
Vacuum chamber
With the VisionXP+. we offer innovative solutions for reflow soldering. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Rehm CoolFlow
In cooperation with Air Liquide, we developed an innovative cooling principle for more efficient use of the nitrogen required for inertisation and built the first reflow soldering system without any cooling water with a nitrogen cooling system. The cryogenic liquid nitrogen (as cold as –196°C) provides its cooling properties inside the system’s cooling zone, evaporates and can then be used for inertisation in its gaseous state. This means that the system is provided both with the required cooling properties and the inert atmosphere. The cooling water, which previously required high energy use for cooling, including cooling unit and refrigerant, is completely eliminated.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the VisionXP+ has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

SSP+
In comparison with the SSP, the SSP+ is characterised by a further setting option at high temperature differences between the individual heating zones. Since from a zone with a high temperature, this temperature is transferred to the neighbouring zone, it may be necessary to actively cool this zone on an ongoing basis in order to ensure the right temperature profile. The in-house extraction system permanently draws in the colder surrounding air and thus ensures precise temperature resistance in the respective zone. The heat which is transferred from neighbouring zones is reduced drastically like this, which ensures optimum zone division.

A perfect fit for your manufacturing environment
The convection soldering systems in the Vision series are available in different lengths and with different transport options. This modular system concept provides a huge amount of flexibility in the production process. Thanks to the flexible transport system, the VisionXS can be set up on an individual basis in accordance with the requirements in terms of the transport tracks and the transport speed. The integrated cold condensation option guarantees you simple cleaning and maintenance of the system thanks to the ease of changing the cooling filter on the reverse side of the system. The maintenance of the system is made even more user-friendly thanks to the use of sustainable materials and durable components. With the Power Cooling Unit, the assemblies can be cooled in a manner that is as gentle as possible in a multistage cooling process in a stable atmosphere.

Extended cooling line
In particular for large, high-mass or sensitive assemblies, standard cooling capacity is sometimes not sufficient for complying with the required cooling gradients. You need a controllable cooling system that meets the requirements here. In addition to our tried-and-tested standard cooling line, we can extend cooling zones or add additional underside cooling.

Quick Exhaust
With quick exhaust, the process atmosphere is extracted in a very short period of time in order to achieve the desired temperature change. The process gas is extracted using the in-house extraction system in the cooling line. The quick exhaust is activated automatically when a programme change to a colder profile takes place. When the temperature is in the tolerance zone specified by the programme, the quick exhaust is automatically deactivated. In the case of a soldering process in a nitrogen atmosphere, the desired residual oxygen value must then be reset by adding nitrogen.

Residue Management
As with all industrial processes, SMT manufacturing creates substances which have to be removed from the process cycle: substances (residues) like soldering fumes, soldering smoke or other organic compounds are released from the solder paste, circuit board or the components. Our effective residue management system cleans the process gas thoroughly and reliably and keeps your system clean. This ensures top soldering quality, minimal downtimes and a long service life for your system.

Innovative procedures adjusted to the material and product
The optimum heat management of the RDS lacquer dryer with upper and lower heaters works with infrared radiation (IR) and/or convection to dry a wide range of materials reliably. By implementing these two heat transfer processes, the systems are optimally designed for the processing of lacquers and castings containing solvents. The exceptional thermal insulation of heating zones and the individually adjustable temperatures allow for optimum profiling of your drying processes – which are perfectly adapted to the requirements of the products. In the drying phase, the temperature is maintained until the material has hardened completely. A stronger convection is needed for this, as the evaporating solvents need to be discharged. After the drying process, the warm process atmosphere is extracted. Despite this, the component still has an outlet temperature of around 60°C. A separate air or water-cooled cooling unit is available as an option here and can be used to achieve significantly lower temperatures.
Convective drying
When drying using the convection process, the process atmosphere is heated up using a hot-air fan and then flows onto the components. The heating elements are attached above and below the transport system. The flow speeds of the upper and lower heating zones are individually adjustable so that the assembly is heated through evenly. This prevents tension in the material.

Combination heating process with IR
In the combination heating process, the heat transfer is carried out with infrared radiation, which is supported by central convection heating. All heating chambers are equipped with high-performance IR radiators. The IR radiation penetrates the circuit board and drives out the solvents from the interior. This enables a faster and more efficient drying process. For the additional convection, the volume flow can be pre-set. The heating base of all IR radiators can also be equipped with glass covers to protect against contamination and for easier cleaning.

Flexible transport systems
The RDS drying systems can be designed with single lane or dual lane transport, with a pin chain conveyor and variable width adjustment or as heavy load transport for goods carriers based on the customer’s requirements. The optional underfloor return transport that can be integrated offers a space-saving solution for circuit board/goods carrier return.

The following transport versions are available:
• Single lane transport: 80 – 460mm
• Dual lane transport: 2 x 90 – 250mm
• Heavy load transport: in accordance with customer requirements

Exhaust system and integrated extraction
The exhaust system ensures safe removal of solvents among other things. Appropriate mechanisms are attached to the input and output of the process chamber, as well as between the heating zones. The process exhaust air is supplied directly to the extraction through the fan. The substances to be hardened and the exhaust products released determine the extraction volume. The extraction function is monitored by a pressure sensor. If there is a problem, the heating switches off automatically and the inflow of new components is stopped. This prevents any flammable gas mixtures from forming in the system.

Cooling zone
In the air-cooled cooling zune, the hot process exhaust air is extracted via the attached exhaust hoses. As well as this, cold ambient air is aspirated and blown in via the panel of nozzles to cool the components. With the water-cooled cooling option, the cooling process is carried out via heat exchangers. There is the option of controlling the cooling process precisely with separately adjustable fans in the individual zones and influencing the cooling gradient accordingly.

Easy maintenance
The control elements of the RDS drying system are easily accessible for minimal maintenance costs. The heating base of the IR radiator can also be equipped with glass covers to protect against contamination and for easier cleaning. This considerably reduces the maintenance required and increases the service life of the radiators. Here, Rehm relies on tried-and-tested components from the reflow soldering systems.

Fast Chip Shooter

SM series models are the best selling products and have been proven by many customers worldwide.

· High-performance chip shooter with a new fly camera
· World's highest speed of 78,000CPH among chip shooters of the same class
· With two gantry dual-lane construction, supports various production modes

Productivity

On-the-fly Placement Method
Possible to recognize a component without stopping while moving after component pickup Minimizes the moving time between pickup and placement positions and ensures zero recognition time
Performance

Dual Lane Shuttle Conveyor
Maximizes the productivity of small boards through dual lane production Secures scalability to large boards using a shuttle conveyor

Reliability

Component Monitoring before/after Placement
Inspect a nozzle for contamination during production to prevent non-inserted and dumped components in advance.

Easy Operation

Easy Component Registration (New Part Editor)
Possible to register component information with the clicking of a mouse by applying a Drag & Drop based component registration system

MSTECH Europe
BUFFERB

FIFO & LIFO Buffer -
fan cooling inside the buffer - Motorise width adjustment function - Dust cover - For Follow me, IPC Hermes, Ethernet communications, etc, need to add SMARTBOX : MSTECH Produt " motorise Automatic width adjustment function - Total storage 20 slots, 25mm picht each - motorized width adjustment -RS-485 communication

MSTECH Europe
CDLC1000B
1M Cooling Dual lane Linking Conveyor - Cooling system.(1m long 8 fans or specify) - 2 segments - Belt - Motorise width adjustment function - Dust cover - For Follow me, IPC Hermes, Ethernet communications, etc .... , need to add SMARTBOX : MSTECH Produt " motorise Automatic width adjustment function Max 250mm PCB width - Pass / Auto Mode - ESD cover with interlock

Stainless steel lead screw width adjustment
Ergonomically designed ESD table
Independent Speed Control for each segment
Using the quality stepper motor and drivers to transfer the boards
Stepper motor
SMEMA Compatible
Conveyor width adjustment : HMI programming (automatic)
High end power switchs
Speed controller
ESD cover with interlock
Conveyor: ESD flat belts
Panasonic PLC control+ Sensor
Working mode: Inspection mode , Pass through
Heavy duty design for machine stable
Top component height 50mm ; Bottom component height: 30mm
Conveyor length : 1000MM, 1 segment
PCB weights: 3kg per PCS
PCB width: 50*50 to 500*460 mm (L*W)
Machine dimension: (L)500mm*(W)950*(H)930MM
Power: AC220V, 50/60 HZ, 1 phase
PCB Convey Direction: L to R, Front rail fixed
Conveyor Height: 900+/-50mm 
Conveyor Speed: 1-12 m/min adjustable
Package gross weight: 105kg

MSTECH Europe
CDLC1500B
1.5M Cooling Dual lane Linking Conveyor - Cooling - ESD cover with interlocksystem.(1m long 12 fans or specify) - 6 segments- Belt - Motorise width adjustment function - Dust cover - For Follow me, IPC Hermes, Ethernet communications, etc .... , need to add SMARTBOX : MSTECH Produt " motorise Automatic width adjustment function - Max 250mm PCB width - Pass / Auto Mode

MSTECH Europe
CDLC500B
0.5M Cooling Dual lane Linking Conveyor, Cooling system.(0.5m long 4 fans or specify) -1 segment- Belt -Motorise width adjustment function - Dust cover - For Follow me, IPC Hermes, Ethernet communications, etc .... , need to add SMARTBOX : MSTECH Produt " motorise Automatic width adjustment function - Max 250mm PCB width - Pass / Auto Mode - ESD cover with interlock