PEMTRON
EAGLE 3D 8800

Through Hole 3D AOI System Bottom
Side Head 3D AOI
▶ Bottom Camera Head Gantry
▶ Simultaneous Inspection Algorithm (2D and 3D)
▶ Telecentric Lens offers Higher Detection Accuracy
▶ High-Speed CPU & Image Processing
▶ User-Friendly GUI
▶ Built in Library Management System
▶ Offline Real-Time Debug Station

3D Measurements Free from Shadows and Reflections
-The EAGLE 3D 8800 AOI uses 8-way projection for 3D measurements on all models to minimize
errors due to shadow effects, and performs 100% 2D & 3D concurrently in all FOV areas.
-This significantly reduces the false call while providing near-perfect detection.

Accurate and convenient inspection using side camera
Four high-definition cameras on the side and a dedicated algorithm optimized for both use and
side inspection is available for real-time inspection.

-4-Way Side Camera (Optional)
-Internal bridge detection not found in Top Camera
-Connector internal detectable
-Convenient Teaching Using Existing Algorithm

27mm high part 3D measurement/inspection
EAGLE 3D AOI offers the option of inspecting up to 30mm in height components with a unique PEMTRON technology.

Clever system engineering: efficient and sustainable
The CondensoXC is a space-saving, powerful system for laboratory applications, small series production and prototyping. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provides optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.

CondensoXC loading concept
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading

Manual front loading
The CondensoXC is manually loaded with pre-assembled product carriers from the front on the operator’s side. In this way, the assemblies can be easily placed on and removed from the interchangeable product carriers. The product carrier is on a rail system to ensure full access to the working area. Assemblies up to 500 x 540mm (W x L) can be placed on the product carriers.

Gentle cooling
After the soldering process, the assembly is cooled to the desired temperature using convection. The bulkhead of the cooling zone is then opened automatically, and the product carrier can be withdrawn on a rail for easy unloading.

- Manual loading axis (Batch System)
- Manual loading of the process chamber via drawer with carrier
- Vacuum Package
- Air cooling section
- Basic workpiece carrier
- Basic color: SN 700 light basic
- Frame color: RAL 7015 slate grey
- VisuII 7.3.x with Windows 10 Enterprise LTSC

The DECAN series models can handle a wide range of components
and maximize productivity with various PCB transfer systems.

· Secures the applicability to components and conveyor flexibility.
· Reduces production time by optimizing the motion sequence.
· Reinforces odd-shape component recognition by applying 3D lighting system

Features

Productivity

Dual Lane PCB Transfer System
Realizes zero PCB loading/unloading time by loading the PCB on the opposite lane and having it stand by during operation (productivity increases by 15% compared to a single lane)


Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Allows optimum combination of conveyor modules by applying a modular conveyor replaceable on site (Shuttle ↔ Dual).


High Reliability

Prevents Reverse Insertion by Recognizing the Polarity Mark at the Bottom Surface of a Component
Recognizes the polarity mark at the bottom surface of a component using the 3-stepped 3D lighting.

Stage Camera 1EA is included

High Performance

Productivity Improvement
Increases the speed and accuracy for placing microchips (03015) Applies dual-lane PCB transfer system (productivity increases by 15% compared to a single lane)
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High Reliability

Adopts a Linear Motor to Realize Low Noise and Vibration
Applies the twin servo control and linear motor to the Y-axis to realize low noise and vibration.

Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Possible to produce various models depending on the Modular Conveyor System replaceable on site.

Easy Operation

Reinforces the Convenience of Machine Software Operation
The built-in optimization software allows a PCB program to be easily created and edited.

The DECAN series models can handle a wide range of components
and maximize productivity with various PCB transfer systems.

· Secures the applicability to components and conveyor flexibility.
· Reduces production time by optimizing the motion sequence.
· Reinforces odd-shape component recognition by applying 3D lighting system

Features

Productivity

Dual Lane PCB Transfer System
Realizes zero PCB loading/unloading time by loading the PCB on the opposite lane and having it stand by during operation (productivity increases by 15% compared to a single lane)


Flexible Production

Supporting Modular Conveyor System for Various Production Environments
Allows optimum combination of conveyor modules by applying a modular conveyor replaceable on site (Shuttle ↔ Dual).


High Reliability

Prevents Reverse Insertion by Recognizing the Polarity Mark at the Bottom Surface of a Component
Recognizes the polarity mark at the bottom surface of a component using the 3-stepped 3D lighting.

Multi-Functional Place

SM series models are the best selling products and have been proven by many customers worldwide.

·Adopts high-pixel vision system allowing accurate placement of IC components.
·Easily registers complex shapes of components with the Polygon function.

Features :

Reliability

Adopts Powerful Camera Algorithm
Improves recognition accuracy with the component image noise removal function and automatic teaching function of components Corrects the pickup position of components such as Chip, TR, BGA and QFP automatically in real time

Easy Operation

Polygon Recognition Algorithm
Allows even the components of a complicated shape to be easily registered by extracting the component shape and recognizing it entirely.

Easy Operation

Multi-Vendor Component Management Function
When the same components are supplied from different component supply devices, allows them to be used without changing a PCB file and downloading it again.

SATURN

3D Inline Solder Paste Inspection system
PEMTRON's 3D Inline Solder Paste Inspection System using
Moiré pattern combines 2D color images with 3D measurement
data to provide more accurate and realistic 3D inspection
image unlike the conventional method that displayed solder
paste through a color map only.

▶ Industry-leading precision and reliability of inspection
- Eliminate shadow using Multi Projection
▶ Real Color Full 3D Imaging Technique
▶ Glue inspection greater than 2mm
▶ Perform 2D & 3D algorithms simultaneously
▶ 64 bit Windows 10 Operating System
▶ Linear Motor Gantry Type Drive
- High-speed precision control improves repeatability
- Reduction of noise/vibrationd
Single Large Model: 510x510mm
Camera: 10MP
Resolution: 15um
Options included:
* Internal Barcode Licence 1D
* Internal Barcode Licence 2D
* Auto program change over (in combination with external reader)
* Offline Editor SPI
* Verification SW
* SPC Server/Client SW
* 3D Calibration Jig SPI

High performances at a breakthrough price

Features
Accurate micro-SMD probing
Best Measurement Accuracy
Fast Probe Speed
Test Capabilities

Key Features
Best measurement accuracy
Accurate Micro-SMD contacting
No cost of fixturing
Intuitive programming
Zero errors at functional test
Field returns are practically eliminated

High throughput meets best accuracy

Features
Accurate micro-SMD probing
Best Measurement Accuracy
Fast Probe Speed

Key Features
High throughput
Best measurement accuracy
Accurate Micro-SMD probing
No cost of fixturing
Intuitive programming
Zero errors at functional test
Field returns are practically eliminated

Test the largest boards

Features
Multi-Mode Dual Side Probing
Test also the biggest ones.
Best Measurement Accuracy
Fast and accurate probing on the smallest components

Key features
Dual side probing: full accessibility & parallel test
Large boards testing: 1000 x 610mm (39.4 x 24’’)
20 kg max board weight
Full test coverage
Conveyor / Automatic / Manual board loading
Micro-SMD & flexible circuit probing

The Fastest in the World

Top Features to Achieve the Best Performances:
- The Best Throughput and Accuracy
- Ultra-Fast Double-sided Probing
- Micro-Probing Accuracy for the Smallest Targets
- Safe Probing with Ultra-Soft Touch Technology
- Configurable Multi-Tool Flying Heads
- Automatic Test of Large and Complex Electronic Boards

The 4080 is an 8-probe multi-functional, high-production Flying Probe Tester designed for testing electronic boards and devices. The tester sets a new benchmark for flying probe board testing, offering the highest probing and electrical measurement accuracy and speed on both sides of the device under test.

The 4080 ensures 100% net accessibility and zero-failure escape thanks to SPEA’s Multi-Domain Test Technology, which provides full test coverage for any test application.

Multi-core multi-function board tester.
High volumes. High quality. Low cost of test

Features

- 4x parallel test. Ultra-fast handling.
- No operator.
- Minimize the cost of test

Key Features

- 4x throughput with 4-Core Architecture
- No operator cost
- Ultra-fast handling in 3 sec.
- 5000+ tests/sec
- Automatic test program generation
- Parallel programming of different-type ICs
- Easy diagnostic of fixture’s pogo pins via mobile app

3030IL is the fully automatic bed-of-nails tester expressly designed to minimize the cost of test, providing unparalleled throughput without requiring the operator to load the PCB or perform the test. It can be quickly integrated into SMEMA production lines, or used with standard automatic board loaders/unloaders. Modular and fully upgradable, 3030IL combines a wide range of test capabilities in a unique, integrated, high-throughput, cost-effective system.

Zero-footprint board tester

Features
- Zero Footprint Design: maximize space & resources
- PC-independent Architecture
- The well-known 3030 series accuracy
- Easy to use: designed for untrained users

Key Features
- Zero Footprint Design
- Multi-Function Test Capabilities
- Ready to be integrated in any production line

Reduce the footprint to zero with SPEA 3030R In-Circuit tester. Designed to be integrated into third-party systems or 19” cabinet, or used manually with a minimum footprint. 3030R saves industrial floor and provides a comprehensive range of test capabilities to your production equipment, with unprecedented throughput.
Accuracy and full fault coverage are guaranteed: 3030R belongs to the SPEA 3030 series, which means 16-bit instrumentation, configurability and scalability according to your needs, and multiple test techniques integrated into a single test station.
Finally, integration into third-party systems brings more than space reduction: common elements such as mechanics and framework are spared, and the cost of test is further reduced.

Test Capabilities

- In-Circuit Test (Analog, Digital, Mixed)
- Power-On Test
- Functional Test
- Flashing via On-Board Programming
- Open Pin Scan
- Boundary Scan
- Built-In Self-Test
- Parametric Test

Multi-core inline-compatible board tester.
High throughput. High coverage.

Key Features
- True 2x Parallel Test
- Fixture compatible with 3030 Inline
- High-speed parametric ICT
- Automatic application development
- Multiple test functions
- Easy diagnostic of fixture’s pogo pins via mobile app

Fully compatible with 3030 Inline.

3030CE is the bed-of-nails tester designed to deliver a cost-effective manual test solution fully compatible with 3030 Inline testers. Fixture, presser and test program can be quickly and easily moved from 3030CE to 3030 Inline and vice versa, without mechanical adjustments. Modular and configurable, 3030CE provides 2x throughput compared with standard test solutions, thanks to its 2-Core Real Parallel Test. 3030CE delivers multiple test capabilities, guaranteeing 100% coverage in a unique, integrated, high-throughput, cost-effective system.

Features
- True Parallel Test
- Fixture & Test Program migration to 3030 Inline
- PC-independent Architecture
- Multi-device Parallel Flashing
- Precise contacting with SPEA’s receivers
- Hi-speed parametric ICT

Test Capabilities

Cost-effective Per-Pin Architecture
Each 3030CE channel is configurable by test program. Every nail can be used to perform any kind of test. This instrument/receiver 1:1 ratio guarantees several benefits: faster test generation, easy ECO management, full flexibility.

Open Pin detection
Two different test techniques, Electro Scan and Junction Scan, can be executed for detecting open pins and other process defects in an easy and fast way.

Functional test
3030CE testers provide not only functional test (FCT) at board level but also at cluster level. Programming is easy with Leonardo OS and by means of high-level languages such as Microsoft C ++, Visual Basic, LabView.

Fully upgradable & customizable
3030CE can be factory-equipped or upgraded on field with the instrumentation useful to satisfy the test requirements. It is possible to integrate power instrumentation (as programmable AC/DC generators, Active Loads, Power Matrix, programmable Power Supplies etc.) as well as third party instruments to increase test capabilities and throughput. Finally, 3030CE can accommodate a wide range of fixture receiver models, also from third parties (Genrad, Ingun, Zentel, Augat Pylon…).

Boundary Scan: test inaccessible parts
The Boundary Scan technique is able to test non-accessible nets and components. The simultaneous use of Boundary Scan technique with SPEA 3030CE ICT instrumentation allows to increase the test coverage reducing in the same time the fixture costs (virtual test points instead of real test nails).

Multi-core multi-function board tester

High throughput. High scalability.
Full test coverage

Key Features
· -75% test cost with True Parallel Test
· Multifunction: full test coverage
· Fully customizable & upgradable
· Equippable with power instrumentation
· Automatic test program generation
· Parallel programming of different-type ICs
· Easy diagnostic of fixture’s pogo pins via mobile app

Features
- 4 Test Cores. True Parallel Test
- Multi-device Parallel Flashing
- PC-independent Architecture
- Fully upgradable & customizable
- Forget field returns

Multifunction test capabilities:
100% coverage with 1 system
3030M is the multi-function, fully upgradable and customizable ICT tester, expressly designed to combine full test coverage and the lowest cost of test into a unique manual test equipment. Modular and configurable with a wide range of instrumentation and receivers, 3030M provides 4x throughput compared with standard testers.

SAVE MONEY – Why buy several testers when you just need one? By using 3030M, multiple test techniques are executed within a unique system. Compared to multiple test stations, benefits are huge: no operator, a single test program, reduced industrial space, faster training and lower operational costs.

SAVE TIME – Test time is greatly reduced by 3030M. First of all, expensive and unnecessary handling operations are avoided. With just one board loading/unloading the tester executes different tests in a optimized way, in order to avoid redundancy and over-test of your product, thus allowing you to save precious time. And what about programming multiple devices? With 3030M and Leonardo OS you just need a few minutes to generate your multi-function test program.

SAVE FIELD RETURNS – 3030M has been designed to help electronics manufacturers to boost their product quality. By executing various test techniques with the same tester used for ICT, all risks related to subsequent handling operations are avoided. At the end of the test the product is ready to be delivered to the final customer.

Test Capabilities

Boundary Scan: test inaccessible parts
The Boundary Scan technique is able to test non-accessible nets and components. The simultaneous use of Boundary Scan technique with SPEA 3030M ICT instrumentation allows to increase the test coverage reducing at the same time the fixture costs (virtual test points instead of real test nails).

Open Pin detection
Two different test techniques, Electro Scan and Junction Scan, can be executed for detecting open pins and other process defects in an easy and fast way.

Functional test
3030M testers provide not only functional test (FCT) at board level but also at cluster level. Programming is easy with Leonardo OS and by means of high level languages such as Microsoft C ++, Visual Basic, LabView.

Cost-effective Per-Pin Architecture
Each 3030M channel is configurable by test program. Every nail can be used to perform any kind of test. This instrument/receiver 1:1 ratio guarantees several benefits: faster test generation, easy ECO management, full flexibility.

Hi-speed parametric ICT
3030M hi-speed ICT parametric test is able to measure each single component value in a very short time. Advantages: programming time reduction (the test is automatically generated), test time reduction (microseconds of ICT test vs. milliseconds of FCT), repairing time reduction (automatic fault device identification).

Fixture & Test Program migration
SPEA Common Architecture allows Leonardo OS test programs to work with all SPEA board test systems, 3030 and even Flying Probers. You can quickly move your production from one system to another, depending on the production needs.

32x Ultra-High Parallelism In-Circuit Tester.

Full Parallel Test

SPEA T300 Board Tester is an unprecedented and unique architecture board test system that supports up to 32 parallel In-Circuit Test cores with additional capability of 256 cores for Flashing and Functional Test. This enables the T300 Asynchronous Parallel Architecture to perform tests and Flash in parallel up to 32 PCBAs (Printed Circuit Board Assemblies).
SPEA T300 bed of nails tester includes SPEA’s unique ICT-Plus test techniques which allow the detection of many defects present in electronics that are not detectable with traditional ICT testing.

Huge number of Test and Flashing in parallel

Most electronic printed circuit boards today are produced in panels composed of a high number of single boards (PCBAs), which in turn contain one or more components that need to be programmed.

The unique and unprecedented SPEA T300 bed of nails tester has been designed precisely to test and program a large number of boards in parallel or a large number of sections of a single big board. This enables high throughput and consequently very-low cost of testing and programming.

Programmable as Single or Dual Test Site. T300 can be programmed to operate as a Single Test Site or Dual Test Site.

- Single Test Site allows for testing of a single panel of boards for ICT, Flash Programming, and Functional test.
- Dual Test Site allows for testing of two panels of boards at the same time for ICT, Flash Programming, and Functional test. In order to double the throughput, the system is capable of performing a Split Test, such as, ICT in site 1 while simultaneously performing Flash Programming and/or Functional test on site 2.

Performance, Reliability, Value.

The PSV2800 delivers ultra-fast performance with industry-leading reliability for dedicated high-volume applications at the lowest total cost of ownership.

Programming Technology

FlashCORE III

At the core of all Data I/O's programming systems is the FlashCORE III programming engine. FlashCORE III is the industry’s most trusted universal programming engine with tens of thousands of devices supported.

- Read/write speeds greater than 10 MBytes per second (80 Mbits/s) for capable devices
- Fast downloads over 100 Base-T Ethernet connection
- Configurable FPGA for optimized programming now and in the future

Performance​
Engineered for speed & agility delivering maximum production throughput

- 3000 parts/hour​
- Scalable up to 6 FlashCORE III programming engines for up to 24 sockets​​​
- Integrated tape input and tape output​
- Supports devices from 2mm x 3mm​ up to 21.5mm x 21.5mm

Reliability
Designed for easy set-up & reliable performance

- Integrated systems software and handling technology for highest quality yield
- Simple UI minimizes operator error
- Supports up to two self-regulating ionizers to provide rapid elimination of ESD
- Highest programming yield up to 99.8%

Value
Delivering the lowest total cost of programming

- Scalable from 1-6 FlashCORE III programmers (4 to 24 sockets)​
- Thousands of devices supported
- Investment protection

Productive, Reliable, Affordable.

High-quality, automated programming system to deliver trusted performance at a great value. The PSV3500 is the cost-effective entry point for high-quality automated device programming for low-volume applications.

Productive
Ideal for first-time automation

- Handler rated up to 700 parts per hour​
- Scalable from 1 LumenX programmer (8 sockets)​ and up to 2 Flash CORE programmers (8 sockets)
- Integrated media options​
- Fiber laser marking​
- Small parts down to 2mm x 3mm up to 42mm x 42mm​

Reliable
Engineered for highest quality programming, uptime, and production yield

- Highest quality programming results
- Intelligent system design & integration​
- Proven pick and place head​
- Integrated vision system for precise placement​

Affordable
High-quality automated programming for the lowest cost per device

- Save up to 3x cost per programmed part
- Investment protection to meet future production requirements
- Lowest total cost of ownership

Programming Technology

LumenX
Ultra-fast programming delivering revolutionary performance, managed and secure programming at a revolutionary value. LumenX programming technology delivers:

FlashCORE III
At the core of all Data I/O's programming systems is the FlashCORE III programming engine. FlashCORE III is the industry’s most trusted universal programming engine with tens of thousands of devices supported.

Efficient, Reliable, Affordable
The PSV5000 is a cost-effective entry point for high-performance automated device programming. The PSV5000 delivers trusted performance, flexibility and reliability at an affordable price.

Efficient
Designed for Optimum performance

- Handler rated up to 1300 parts per hour​
-Scalable from 1 to 5 LumenX programmers (1 to 40 socket)​ or 1 - 6 FlashCORE programmers (4 to 24 sockets)
- Integrated media options​
- Fiber laser marking​
- Small parts down to 2mm x 3mm up to 42mm x 42mm​

Reliable
Engineered for highest quality programming, up-time & production yield​

- Highest quality programming results up to 99.8% yield
- Intelligent system design & integration​
- Proven pick and place head​
- Integrated vision system for precise placement​

Affordable
Developed to deliver high quality automated programming for the lowest cost per programmed device

- Up to 50% less cost per programmed part
- Investment protection to meet future production requirements
- Upgrade to SentriX for true security provisioning
- Lowest total cost of ownership

Velocity, Versatility, Value.
The world's premier automated programming system. The PSV7000 is engineered for speed and accuracy delivering blazing fast throughput, highest up-time, flexibility, and fast changeover to handle complex jobs at up to 50% lower cost.

Velocity
Engineered for speed and accuracy, the PSV7000 gives you blazing fast throughput and the highest uptime

- Up to 2000 devices/hour with tray, tape and tube
- Optimized throughput with Speed Factor
- Alignment-on-the-fly
- Zero mechanical changeover
- Simple, fast, and accurate teach with NexTeach Pro

Versatility
Designed for ultimate flexibility and zero changeover

- Small parts handling down to 1.5mm x 1.5mm
- Greatest socket density: scalable up to 14 LumenX programmer for up to 112 sockets or 24 FlashCORE III programmers for up to 96 sockets
- Concurrently installed media options including dual input tray feeder, tape & tube
- Ergonomic design for easy access
- Upgrade to SentriX for true security provisioning

Value
The PSV7000 delivers unprecedented capability & quality for the lowest total cost of ownership

- Up to 50% less cost per programmed part
- Investment protection to meet future production requirements
- Lowest total cost of ownership

Programming Technology
LumenX
Ultra-fast programming delivering revolutionary performance, managed and secure programming at a revolutionary value. LumenX programming technology delivers

FlashCORE III
At the core of all Data I/O's programming systems is the FlashCORE III programming engine. FlashCORE III is the industry’s most trusted universal programming engine with tens of thousands of devices supported.