Clever system engineering: efficient and sustainable
The CondensoXC is a space-saving, powerful system for laboratory applications, small series production and prototyping. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provides optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.

CondensoXC loading concept
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading

Manual front loading
The CondensoXC is manually loaded with pre-assembled product carriers from the front on the operator’s side. In this way, the assemblies can be easily placed on and removed from the interchangeable product carriers. The product carrier is on a rail system to ensure full access to the working area. Assemblies up to 500 x 540mm (W x L) can be placed on the product carriers.

Gentle cooling
After the soldering process, the assembly is cooled to the desired temperature using convection. The bulkhead of the cooling zone is then opened automatically, and the product carrier can be withdrawn on a rail for easy unloading.

- Manual loading axis (Batch System)
- Manual loading of the process chamber via drawer with carrier
- Vacuum Package
- Air cooling section
- Basic workpiece carrier
- Basic color: SN 700 light basic
- Frame color: RAL 7015 slate grey
- VisuII 7.3.x with Windows 10 Enterprise LTSC

The 3-in-1 solution for your soldering process.
Vision TripleX: a patented new development in the field of convection and vapor phase soldering. The system is based on the reflow convection soldering systems in the Vision series and combines the convection soldering process with the proven vapor phase soldering process of the Condenso series. Thus, three processes can be carried out in the Vision TripleX: reflow convection soldering with and without vacuum and vapor phase soldering using Galden®. This provides uniquely flexible manufacturing options.

Vacuum chamber
Vacuum soldering is one of the three soldering processes integrated in the Vision TripleX. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Active Galden® filtering
After soldering, the assembly is passed onto the cooling process. Process gas is extracted and cleaned at the same time. Therefore, a large part of the Galden® can be reused, a solution that is particularly material-friendly and environmentally friendly! A vacuum is created during extraction which also ensures that soldering material is dried quickly.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the Vision TripleX has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

Energy-efficient system facilitates low-maintenance manufacturing
The VisionXP+ is our "best in class" reflow convection soldering system, which is clearly in line with the trend towards the sustainable management of resources. With a particular focus on energy efficiency, reducing emissions and operating costs, EC motors were integrated into the VisionXP+ and these enable you to save on energy in a provable manner. The option of carrying out vacuum soldering enables you to create a time-efficient and stable production procedure, as well as to reduce voids, in order to ensure low-maintenance manufacturing. With the VisionXP+, you have various options available to you for gentle cooling, including underside cooling. With this, especially high-mass boards in particular can be cooled easily.
Vacuum chamber
With the VisionXP+. we offer innovative solutions for reflow soldering. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Rehm CoolFlow
In cooperation with Air Liquide, we developed an innovative cooling principle for more efficient use of the nitrogen required for inertisation and built the first reflow soldering system without any cooling water with a nitrogen cooling system. The cryogenic liquid nitrogen (as cold as –196°C) provides its cooling properties inside the system’s cooling zone, evaporates and can then be used for inertisation in its gaseous state. This means that the system is provided both with the required cooling properties and the inert atmosphere. The cooling water, which previously required high energy use for cooling, including cooling unit and refrigerant, is completely eliminated.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the VisionXP+ has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

SSP+
In comparison with the SSP, the SSP+ is characterised by a further setting option at high temperature differences between the individual heating zones. Since from a zone with a high temperature, this temperature is transferred to the neighbouring zone, it may be necessary to actively cool this zone on an ongoing basis in order to ensure the right temperature profile. The in-house extraction system permanently draws in the colder surrounding air and thus ensures precise temperature resistance in the respective zone. The heat which is transferred from neighbouring zones is reduced drastically like this, which ensures optimum zone division.

A perfect fit for your manufacturing environment
The convection soldering systems in the Vision series are available in different lengths and with different transport options. This modular system concept provides a huge amount of flexibility in the production process. Thanks to the flexible transport system, the VisionXS can be set up on an individual basis in accordance with the requirements in terms of the transport tracks and the transport speed. The integrated cold condensation option guarantees you simple cleaning and maintenance of the system thanks to the ease of changing the cooling filter on the reverse side of the system. The maintenance of the system is made even more user-friendly thanks to the use of sustainable materials and durable components. With the Power Cooling Unit, the assemblies can be cooled in a manner that is as gentle as possible in a multistage cooling process in a stable atmosphere.

Extended cooling line
In particular for large, high-mass or sensitive assemblies, standard cooling capacity is sometimes not sufficient for complying with the required cooling gradients. You need a controllable cooling system that meets the requirements here. In addition to our tried-and-tested standard cooling line, we can extend cooling zones or add additional underside cooling.

Quick Exhaust
With quick exhaust, the process atmosphere is extracted in a very short period of time in order to achieve the desired temperature change. The process gas is extracted using the in-house extraction system in the cooling line. The quick exhaust is activated automatically when a programme change to a colder profile takes place. When the temperature is in the tolerance zone specified by the programme, the quick exhaust is automatically deactivated. In the case of a soldering process in a nitrogen atmosphere, the desired residual oxygen value must then be reset by adding nitrogen.

Residue Management
As with all industrial processes, SMT manufacturing creates substances which have to be removed from the process cycle: substances (residues) like soldering fumes, soldering smoke or other organic compounds are released from the solder paste, circuit board or the components. Our effective residue management system cleans the process gas thoroughly and reliably and keeps your system clean. This ensures top soldering quality, minimal downtimes and a long service life for your system.

Innovative procedures adjusted to the material and product
The optimum heat management of the RDS lacquer dryer with upper and lower heaters works with infrared radiation (IR) and/or convection to dry a wide range of materials reliably. By implementing these two heat transfer processes, the systems are optimally designed for the processing of lacquers and castings containing solvents. The exceptional thermal insulation of heating zones and the individually adjustable temperatures allow for optimum profiling of your drying processes – which are perfectly adapted to the requirements of the products. In the drying phase, the temperature is maintained until the material has hardened completely. A stronger convection is needed for this, as the evaporating solvents need to be discharged. After the drying process, the warm process atmosphere is extracted. Despite this, the component still has an outlet temperature of around 60°C. A separate air or water-cooled cooling unit is available as an option here and can be used to achieve significantly lower temperatures.
Convective drying
When drying using the convection process, the process atmosphere is heated up using a hot-air fan and then flows onto the components. The heating elements are attached above and below the transport system. The flow speeds of the upper and lower heating zones are individually adjustable so that the assembly is heated through evenly. This prevents tension in the material.

Combination heating process with IR
In the combination heating process, the heat transfer is carried out with infrared radiation, which is supported by central convection heating. All heating chambers are equipped with high-performance IR radiators. The IR radiation penetrates the circuit board and drives out the solvents from the interior. This enables a faster and more efficient drying process. For the additional convection, the volume flow can be pre-set. The heating base of all IR radiators can also be equipped with glass covers to protect against contamination and for easier cleaning.

Flexible transport systems
The RDS drying systems can be designed with single lane or dual lane transport, with a pin chain conveyor and variable width adjustment or as heavy load transport for goods carriers based on the customer’s requirements. The optional underfloor return transport that can be integrated offers a space-saving solution for circuit board/goods carrier return.

The following transport versions are available:
• Single lane transport: 80 – 460mm
• Dual lane transport: 2 x 90 – 250mm
• Heavy load transport: in accordance with customer requirements

Exhaust system and integrated extraction
The exhaust system ensures safe removal of solvents among other things. Appropriate mechanisms are attached to the input and output of the process chamber, as well as between the heating zones. The process exhaust air is supplied directly to the extraction through the fan. The substances to be hardened and the exhaust products released determine the extraction volume. The extraction function is monitored by a pressure sensor. If there is a problem, the heating switches off automatically and the inflow of new components is stopped. This prevents any flammable gas mixtures from forming in the system.

Cooling zone
In the air-cooled cooling zune, the hot process exhaust air is extracted via the attached exhaust hoses. As well as this, cold ambient air is aspirated and blown in via the panel of nozzles to cool the components. With the water-cooled cooling option, the cooling process is carried out via heat exchangers. There is the option of controlling the cooling process precisely with separately adjustable fans in the individual zones and influencing the cooling gradient accordingly.

Easy maintenance
The control elements of the RDS drying system are easily accessible for minimal maintenance costs. The heating base of the IR radiator can also be equipped with glass covers to protect against contamination and for easier cleaning. This considerably reduces the maintenance required and increases the service life of the radiators. Here, Rehm relies on tried-and-tested components from the reflow soldering systems.

MSTECH Europe
MTU-350

The MTU-350 is a high-performance wave soldering machine designed for precise, stable, and efficient PCB assembly. Featuring advanced heating technology, dual-wave soldering, and intelligent control systems, it ensures consistent, high-quality solder joints while optimizing production throughput.
Applications
Ideal for through-hole and mixed-technology PCB assembly in:

Consumer electronics
Automotive electronics
Industrial electronics manufacturing
EMS and high-volume production lines

Key Features

Dual wave system: laminar + dancer for optimal solder quality
High-precision temperature control (±1°C) for stable processes
4-zone preheating system (1800 mm) with hot air convection
Supports PCB widths from 50 to 350 mm
PLC + PC control with automatic alarms and scheduling
Automatic flux spraying system with adjustable flow rate
Automatic finger cleaning system with recyclable solution
Energy-efficient operation with matrix heating (up to 95% efficiency)
SMEMA interface for easy line integration

MSTECH Europe
MTU-450

MTU-450 Wave Soldering Machine
The MTU-450 is a high-capacity wave soldering machine designed for wide PCB applications, delivering precise, stable, and efficient soldering performance. With advanced dual-wave technology, intelligent control systems, and robust construction, it ensures consistent high-quality results for demanding production environments.
Applications
Ideal for large-format and high-density PCB assembly, including:

Consumer electronics
Automotive electronics
Industrial and power electronics
EMS and high-volume production lines

Key Features

Extended PCB handling up to 450 mm width
Dual wave system: laminar + dancer for superior solder quality
High-precision temperature control (±1°C)
4-zone preheating system (1800 mm) with hot air convection
PLC + PC control system with alarms, automation, and scheduling
Automatic flux spraying system with intelligent detection and adjustable flow
Advanced flux management with recycling and exhaust filtration system
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust, fully enclosed design for safety and ease of maintenance
SMEMA interface for seamless production line integration

MSTECH Europe,
MTU-500

The MTU-500 is a large-format, high-capacity wave soldering machine designed for demanding PCB production environments. Built for maximum throughput and precision, it combines advanced dual-wave technology, intelligent automation, and efficient thermal management to deliver excellent soldering quality on complex and wide PCBs.
Applications
Ideal for extra-wide and complex PCB assemblies, including:

Automotive and power electronics
Industrial equipment and control systems
Large consumer electronics boards
EMS high-volume production lines

Key Features

Extended PCB capacity up to 500 mm width for large-format boards
Dual wave system: laminar (first) + dancer (second) for optimal soldering results
High-precision temperature control (±1°C)
4-zone preheating system (1800 mm) with hot air convection
Advanced PLC + PC control system with intelligent automation and alarms
Automatic flux spraying system with detection and adjustable flow
Enhanced flux management system with recycling, air curtain, and filtration
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust enclosed structure for durability, safety, and easy maintenance
SMEMA interface for seamless integration into production lines

MSTECH Europe
MTU-610

MTU-610 Wave Soldering Machine
The MTU-610 is a large-format, high-capacity wave soldering system designed for extra-wide PCB production and demanding industrial applications. Combining dual-wave soldering, advanced automation, and highly efficient heating technology, it delivers exceptional solder quality, process stability, and productivity for complex assemblies.
Applications
Ideal for very large and complex PCB assemblies, including:

Automotive and power electronics
Industrial control systems and infrastructure
Large-format consumer electronics
EMS high-volume and heavy-duty production lines

Key Features

Extra-wide PCB capability up to 610 mm
Dual wave system: laminar (first) + dancer (second) for optimal soldering performance
High-precision temperature control (±1°C) ensures process stability
4-zone preheating system (1800 mm) with hot air convection
Advanced PLC + PC control system with automation, alarms, and scheduling
Automatic flux spraying system with intelligent PCB detection and adjustable flow
Comprehensive flux management system (recycling, filtration, air curtain)
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust enclosed machine design for safety, durability, and easy maintenance
SMEMA compatibility for seamless line integration

MSTECH Europe
Classic Mecury Oven

The Mercury oven is designed for efficient and uniform curing of coatings, adhesives, and encapsulants in SMT and electronics manufacturing. It ensures controlled heat distribution for reliable curing performance, improving product quality and consistency. With adjustable conveyor speed, it easily adapts to different curing profiles and production requirements, making it suitable for continuous inline processing across a wide range of electronic assemblies.

MSTECH Europe
Classic MTR-600
The MTR-600 is a high-performance SMT reflow oven designed for precise and reliable lead-free soldering. It combines advanced hot air convection heating with an industrial control system to ensure consistent thermal results and efficient production.
Key Features

12 heating zones (6 top / 6 bottom) + 2 cooling zones
Temperature range: Ambient to 300°C
High accuracy: ±1°C (control), ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & real-time monitoring
Energy efficient: ~5KW operating consumption
Built-in UPS for power failure protection
MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min (adjustable)
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

Forced air cooling, PCB exit ≤ 70°C
Stable heat balance and fast response time (≤20s)

Technical Specs

Dimensions: 4100 × 1430 × 1530 mm
Weight: ~2200 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 48KW

MSTECH Europe
Classic MTR-800
The MTR-800 is a high-capacity SMT reflow oven engineered for precision lead-free soldering and high-throughput production. With extended heating zones and advanced control, it ensures excellent thermal uniformity and process stability.
Key Features

16 heating zones (8 top / 8 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage and monitoring
Energy consumption: ~9KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast thermal response (≤20s)

Technical Specs

Dimensions: 5520 × 1430 × 1530 mm
Weight: ~2710 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 64KW

MSTECH Europe
Classic MTR-1000
The MTR-1000 is a high-capacity SMT reflow oven designed for demanding production environments, delivering superior thermal uniformity, precision, and throughput for lead-free soldering.
Key Features

20 heating zones (10 top / 10 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & monitoring
Energy consumption: ~10KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast heat response (≤20s)

Technical Specs

Dimensions: 6300 × 1430 × 1530 mm
Weight: ~3020 kg
Power supply: 3P 380V, 50/60Hz
Total power: 80KW

MSTECH Europe
Classic MTR-1200
The MTR-1200 is a high-end SMT reflow oven designed for maximum throughput and thermal performance, ideal for complex and high-volume lead-free soldering applications.
Key Features

24 heating zones (12 top / 12 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & monitoring
Energy consumption: ~13KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast thermal response (≤20s)

Technical Specs

Dimensions: 7050 × 1430 × 1530 mm
Weight: ~3710 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 96KW

MSTECH Europe
Classic MTX-250
The MTX-250 Vertical Oven is a compact and efficient solution for PCB thermal processing, designed to maximize floor space while ensuring precise temperature control and stable production flow.
Key Features

Vertical design with 60 layers for high-capacity processing
8 heating modules (4×2) for uniform heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C uniformity
Fast throughput: minimum 35 seconds per PCB & pallet
Servo-driven lifting system for smooth and reliable operation
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 300 × 250 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 1770 × 2030 × 2160 mm
Weight: ~1500 kg
Heating power: 48 KW (8 × 6 KW)
Conveyor height: 900 ± 30 mm

MSTECH Europe
Classic MTX-450
The MTX-450 Vertical Oven is a high-capacity thermal processing solution designed for larger PCBs, combining space-saving vertical design with precise temperature control and reliable automation.
Key Features

Vertical system with 60 layers for high throughput
8 heating modules (4×2) for consistent heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C uniformity
Fast cycle time: from 35 seconds per PCB & pallet
Servo-driven lifting system for smooth, accurate handling
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 400 × 450 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 2200 × 2230 × 2160 mm
Weight: ~1800 kg
Heating power: 64 KW (8 × 8 KW)
Conveyor height: 900 ± 30 mm

MSTECH Europe
Classic MTX-650
The MTX-650 Vertical Oven is a high-capacity solution designed for large-format PCB processing, combining a space-saving vertical design with precise temperature control and high throughput performance.
Key Features

Vertical system with 60 layers for maximum productivity
8 heating modules (4×2) for uniform heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C temperature uniformity
Fast cycle time: from 35 seconds per PCB & pallet
Servo-driven lifting system for smooth, reliable operation
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 600 × 650 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 3000 × 2460 × 2160 mm
Weight: ~2100 kg
Heating power: 72 KW (8 × 9 KW)
Conveyor height: 900 ± 30 mm