Clever system engineering: efficient and sustainable
The CondensoXC is a space-saving, powerful system for laboratory applications, small series production and prototyping. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provides optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.

CondensoXC loading concept
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading

Manual front loading
The CondensoXC is manually loaded with pre-assembled product carriers from the front on the operator’s side. In this way, the assemblies can be easily placed on and removed from the interchangeable product carriers. The product carrier is on a rail system to ensure full access to the working area. Assemblies up to 500 x 540mm (W x L) can be placed on the product carriers.

Gentle cooling
After the soldering process, the assembly is cooled to the desired temperature using convection. The bulkhead of the cooling zone is then opened automatically, and the product carrier can be withdrawn on a rail for easy unloading.

- Manual loading axis (Batch System)
- Manual loading of the process chamber via drawer with carrier
- Vacuum Package
- Air cooling section
- Basic workpiece carrier
- Basic color: SN 700 light basic
- Frame color: RAL 7015 slate grey
- VisuII 7.3.x with Windows 10 Enterprise LTSC

VX air HK
Rehm Thermal Systems


The 3-in-1 solution for your soldering process.
Vision TripleX: a patented new development in the field of convection and vapor phase soldering. The system is based on the reflow convection soldering systems in the Vision series and combines the convection soldering process with the proven vapor phase soldering process of the Condenso series. Thus, three processes can be carried out in the Vision TripleX: reflow convection soldering with and without vacuum and vapor phase soldering using Galden®. This provides uniquely flexible manufacturing options.

Vacuum chamber
Vacuum soldering is one of the three soldering processes integrated in the Vision TripleX. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Active Galden® filtering
After soldering, the assembly is passed onto the cooling process. Process gas is extracted and cleaned at the same time. Therefore, a large part of the Galden® can be reused, a solution that is particularly material-friendly and environmentally friendly! A vacuum is created during extraction which also ensures that soldering material is dried quickly.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the Vision TripleX has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

VX Air "Air Reflow Soldering System"
with...
- Pin Chain Conveyor nickel plated (pin length 5 mm standard)
- PCB-widths from 50-508mm (with CBS 65-508mm)
- manual conveyor width adjustment (electrical - inching operation)
- top and bottom heating
- Fan Speed Regulation 1 included , heating Top
- Fluxmanagement FFS (Flux Filter System)
- flatscreen monitor ( Touch 23" )and signal tower (three-coloured) build-in
- Industrial PC-control with Ethernet-network-interface (RAID hard disk)
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- colour: SN700 (Light Basic)
- Hoods front side / hoods bridge: RAL 7015 (slate grey)
- CE conformity
- Integrated Exhaust fan

VXP+ (V1) nitro Inert Reflow Soldering System
Rehm Thermal Systems

Energy-efficient system facilitates low-maintenance manufacturing
The VisionXP+ is our "best in class" reflow convection soldering system, which is clearly in line with the trend towards the sustainable management of resources. With a particular focus on energy efficiency, reducing emissions and operating costs, EC motors were integrated into the VisionXP+ and these enable you to save on energy in a provable manner. The option of carrying out vacuum soldering enables you to create a time-efficient and stable production procedure, as well as to reduce voids, in order to ensure low-maintenance manufacturing. With the VisionXP+, you have various options available to you for gentle cooling, including underside cooling. With this, especially high-mass boards in particular can be cooled easily.
Vacuum chamber
With the VisionXP+. we offer innovative solutions for reflow soldering. In just one process, a vacuum module enables convection soldering processes to be carried out with a vacuum. This reliably removes pores, gas occlusions and voids immediately after the soldering process whilst the solder is still in its optimal molten state. Complex processing of the assembly via an external vacuum system is no longer necessary and the workpieces are moved straight into the vacuum process from the peak zones.

Rehm CoolFlow
In cooperation with Air Liquide, we developed an innovative cooling principle for more efficient use of the nitrogen required for inertisation and built the first reflow soldering system without any cooling water with a nitrogen cooling system. The cryogenic liquid nitrogen (as cold as –196°C) provides its cooling properties inside the system’s cooling zone, evaporates and can then be used for inertisation in its gaseous state. This means that the system is provided both with the required cooling properties and the inert atmosphere. The cooling water, which previously required high energy use for cooling, including cooling unit and refrigerant, is completely eliminated.

Pyrolysis
During the soldering process, substances that are released from circuit boards, solder paste or components must be filtered out of the process gas. This is why the VisionXP+ has a residue management system which recycles and cleans the process gas in the system. It combines the effect mechanisms of pyrolysis in the preheating and peak range with cold condensation in the cooling zone. The pyrolysis is set up so that it only needs to be cleaned once a year, which results in long maintenance cycles, as well as a clean and dry process chamber.

SSP+
In comparison with the SSP, the SSP+ is characterised by a further setting option at high temperature differences between the individual heating zones. Since from a zone with a high temperature, this temperature is transferred to the neighbouring zone, it may be necessary to actively cool this zone on an ongoing basis in order to ensure the right temperature profile. The in-house extraction system permanently draws in the colder surrounding air and thus ensures precise temperature resistance in the respective zone. The heat which is transferred from neighbouring zones is reduced drastically like this, which ensures optimum zone division.

VXP+ (V1) nitro Inert Reflow Soldering System with...
- top and bottom heating
- fan speed control (1x heating top / 1x heating bottom / 1x cooling section)
- Software control for fan speed regulation
- integr. cooling circuit and heat exchanger for connection to ext. facility water supplies
- integrated pyrolyse system
- manual conveyor width adjustment (electrical - inching operation)
- flatscreen monitor and signal tower (three-coloured)
- PCB-width from 55-508mm (with CBS 65-508mm)
- with pin chain conveyor nickel plated 5 mm standard
- Industrial PC-control with Ethernet-network-interface
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- CE conformity
- Stand-by operation (nitrogen- and power saving)
- incl. transmission zone for finer adjustment of cooling gradient
- Basic color: SN 700 light basic
- Hoods front side / hoods bridge: RAL 7015 slate grey
- Rehm Analytics Recorder
- Passage direction left to right

MSTECH Europe
MTU-350

The MTU-350 is a high-performance wave soldering machine designed for precise, stable, and efficient PCB assembly. Featuring advanced heating technology, dual-wave soldering, and intelligent control systems, it ensures consistent, high-quality solder joints while optimizing production throughput.
Applications
Ideal for through-hole and mixed-technology PCB assembly in:

Consumer electronics
Automotive electronics
Industrial electronics manufacturing
EMS and high-volume production lines

Key Features

Dual wave system: laminar + dancer for optimal solder quality
High-precision temperature control (±1°C) for stable processes
4-zone preheating system (1800 mm) with hot air convection
Supports PCB widths from 50 to 350 mm
PLC + PC control with automatic alarms and scheduling
Automatic flux spraying system with adjustable flow rate
Automatic finger cleaning system with recyclable solution
Energy-efficient operation with matrix heating (up to 95% efficiency)
SMEMA interface for easy line integration

MSTECH Europe
MTU-450

MTU-450 Wave Soldering Machine
The MTU-450 is a high-capacity wave soldering machine designed for wide PCB applications, delivering precise, stable, and efficient soldering performance. With advanced dual-wave technology, intelligent control systems, and robust construction, it ensures consistent high-quality results for demanding production environments.
Applications
Ideal for large-format and high-density PCB assembly, including:

Consumer electronics
Automotive electronics
Industrial and power electronics
EMS and high-volume production lines

Key Features

Extended PCB handling up to 450 mm width
Dual wave system: laminar + dancer for superior solder quality
High-precision temperature control (±1°C)
4-zone preheating system (1800 mm) with hot air convection
PLC + PC control system with alarms, automation, and scheduling
Automatic flux spraying system with intelligent detection and adjustable flow
Advanced flux management with recycling and exhaust filtration system
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust, fully enclosed design for safety and ease of maintenance
SMEMA interface for seamless production line integration

MSTECH Europe,
MTU-500

The MTU-500 is a large-format, high-capacity wave soldering machine designed for demanding PCB production environments. Built for maximum throughput and precision, it combines advanced dual-wave technology, intelligent automation, and efficient thermal management to deliver excellent soldering quality on complex and wide PCBs.
Applications
Ideal for extra-wide and complex PCB assemblies, including:

Automotive and power electronics
Industrial equipment and control systems
Large consumer electronics boards
EMS high-volume production lines

Key Features

Extended PCB capacity up to 500 mm width for large-format boards
Dual wave system: laminar (first) + dancer (second) for optimal soldering results
High-precision temperature control (±1°C)
4-zone preheating system (1800 mm) with hot air convection
Advanced PLC + PC control system with intelligent automation and alarms
Automatic flux spraying system with detection and adjustable flow
Enhanced flux management system with recycling, air curtain, and filtration
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust enclosed structure for durability, safety, and easy maintenance
SMEMA interface for seamless integration into production lines

MSTECH Europe
MTU-610

MTU-610 Wave Soldering Machine
The MTU-610 is a large-format, high-capacity wave soldering system designed for extra-wide PCB production and demanding industrial applications. Combining dual-wave soldering, advanced automation, and highly efficient heating technology, it delivers exceptional solder quality, process stability, and productivity for complex assemblies.
Applications
Ideal for very large and complex PCB assemblies, including:

Automotive and power electronics
Industrial control systems and infrastructure
Large-format consumer electronics
EMS high-volume and heavy-duty production lines

Key Features

Extra-wide PCB capability up to 610 mm
Dual wave system: laminar (first) + dancer (second) for optimal soldering performance
High-precision temperature control (±1°C) ensures process stability
4-zone preheating system (1800 mm) with hot air convection
Advanced PLC + PC control system with automation, alarms, and scheduling
Automatic flux spraying system with intelligent PCB detection and adjustable flow
Comprehensive flux management system (recycling, filtration, air curtain)
Automatic finger cleaning system with recyclable alcohol solution
Energy-efficient matrix heating (up to 95%)
Robust enclosed machine design for safety, durability, and easy maintenance
SMEMA compatibility for seamless line integration

MSTECH Europe
Classic Mecury Oven

The Mercury oven is designed for efficient and uniform curing of coatings, adhesives, and encapsulants in SMT and electronics manufacturing. It ensures controlled heat distribution for reliable curing performance, improving product quality and consistency. With adjustable conveyor speed, it easily adapts to different curing profiles and production requirements, making it suitable for continuous inline processing across a wide range of electronic assemblies.

MSTECH Europe
Classic MTR-600
The MTR-600 is a high-performance SMT reflow oven designed for precise and reliable lead-free soldering. It combines advanced hot air convection heating with an industrial control system to ensure consistent thermal results and efficient production.
Key Features

12 heating zones (6 top / 6 bottom) + 2 cooling zones
Temperature range: Ambient to 300°C
High accuracy: ±1°C (control), ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & real-time monitoring
Energy efficient: ~5KW operating consumption
Built-in UPS for power failure protection
MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min (adjustable)
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

Forced air cooling, PCB exit ≤ 70°C
Stable heat balance and fast response time (≤20s)

Technical Specs

Dimensions: 4100 × 1430 × 1530 mm
Weight: ~2200 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 48KW

MSTECH Europe
Classic MTR-800
The MTR-800 is a high-capacity SMT reflow oven engineered for precision lead-free soldering and high-throughput production. With extended heating zones and advanced control, it ensures excellent thermal uniformity and process stability.
Key Features

16 heating zones (8 top / 8 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage and monitoring
Energy consumption: ~9KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast thermal response (≤20s)

Technical Specs

Dimensions: 5520 × 1430 × 1530 mm
Weight: ~2710 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 64KW

MSTECH Europe
Classic MTR-1000
The MTR-1000 is a high-capacity SMT reflow oven designed for demanding production environments, delivering superior thermal uniformity, precision, and throughput for lead-free soldering.
Key Features

20 heating zones (10 top / 10 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & monitoring
Energy consumption: ~10KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast heat response (≤20s)

Technical Specs

Dimensions: 6300 × 1430 × 1530 mm
Weight: ~3020 kg
Power supply: 3P 380V, 50/60Hz
Total power: 80KW

MSTECH Europe
Classic MTR-1200
The MTR-1200 is a high-end SMT reflow oven designed for maximum throughput and thermal performance, ideal for complex and high-volume lead-free soldering applications.
Key Features

24 heating zones (12 top / 12 bottom) + 6 cooling zones
Temperature range: Ambient to 300°C
High precision: ±1°C control, ±1.5°C PCB deviation
Fast warm-up: ~30 minutes
Industrial PC control with profile storage & monitoring
Energy consumption: ~13KW
UPS, MES & LAN connectivity

Conveyor & Capacity

PCB width: 50–460 mm
Speed: 300–2000 mm/min
Chain + mesh conveyor with automatic lubrication
Component height: up to 30 mm (top & bottom)

Cooling & Performance

3-zone forced air cooling (960 mm)
PCB exit temperature ≤ 70°C
Fast thermal response (≤20s)

Technical Specs

Dimensions: 7050 × 1430 × 1530 mm
Weight: ~3710 kg
Power supply: 3P 380V / 220V, 50/60Hz
Total power: 96KW

MSTECH Europe
Classic MTX-250
The MTX-250 Vertical Oven is a compact and efficient solution for PCB thermal processing, designed to maximize floor space while ensuring precise temperature control and stable production flow.
Key Features

Vertical design with 60 layers for high-capacity processing
8 heating modules (4×2) for uniform heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C uniformity
Fast throughput: minimum 35 seconds per PCB & pallet
Servo-driven lifting system for smooth and reliable operation
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 300 × 250 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 1770 × 2030 × 2160 mm
Weight: ~1500 kg
Heating power: 48 KW (8 × 6 KW)
Conveyor height: 900 ± 30 mm

MSTECH Europe
Classic MTX-450
The MTX-450 Vertical Oven is a high-capacity thermal processing solution designed for larger PCBs, combining space-saving vertical design with precise temperature control and reliable automation.
Key Features

Vertical system with 60 layers for high throughput
8 heating modules (4×2) for consistent heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C uniformity
Fast cycle time: from 35 seconds per PCB & pallet
Servo-driven lifting system for smooth, accurate handling
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 400 × 450 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 2200 × 2230 × 2160 mm
Weight: ~1800 kg
Heating power: 64 KW (8 × 8 KW)
Conveyor height: 900 ± 30 mm

MSTECH Europe
Classic MTX-650
The MTX-650 Vertical Oven is a high-capacity solution designed for large-format PCB processing, combining a space-saving vertical design with precise temperature control and high throughput performance.
Key Features

Vertical system with 60 layers for maximum productivity
8 heating modules (4×2) for uniform heat distribution
Temperature range: up to 200°C
High precision: ±1°C control, ≤±2°C temperature uniformity
Fast cycle time: from 35 seconds per PCB & pallet
Servo-driven lifting system for smooth, reliable operation
Optional Nitrogen (N₂) and cleanroom configuration

Capacity & Handling

Max PCB size: 600 × 650 mm
Product weight: up to 3 kg per layer
Component height: up to 25 mm
Inline entrance & exit conveyors
Manual or automatic rail width adjustment

Technical Specs

Dimensions: 3000 × 2460 × 2160 mm
Weight: ~2100 kg
Heating power: 72 KW (8 × 9 KW)
Conveyor height: 900 ± 30 mm

VXS Nitro HK
Rehm Thermal Systems

VisionXS - Medium Range Reflow Oven from Rehm Thermal Systems is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.

VXS nitro "Inert Reflow Soldering System" with...

- Pin Chain Conveyor nickel plated (pin length 5mm standard)
- PCB-widths from 50-508mm (with CBS 65-508mm)
- manual conveyor width adjustment (electrical - inching operation)
- top and bottom heating
- Fan Speed Regulation 1 included , heating Top
- integr. cooling circuit and heat exchanger for connection to ext. facility water supplies
- Flux Management , CZ MARS & Front FMS
- 1 pcs Gas Probe / Peak)
- flatscreen monitor ( Touch 23" )and signal tower (three-coloured) build-in
- Industrial PC-control with Ethernet-network-interface (RAID hard disk)
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- colour: SN700 (Light Basic)
- Hoods front side / hoods bridge: RAL 7015 (slate grey)
- CE conformity
- incl. transmission zone for finer adjustment of cooling gradient

VXP+ VAC
Rehm Thermal Systems

VisionXP+ - High End Reflow Oven from Rehm Thermal Systems is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.

VXP+ nitro 3850 (Type 734) VAC, heating zone length 350mm, 4 cooling zones, Single Lane

VXP+ nitro VAC Inert Reflow Soldering System with...
- continuous top and bottom heating
- fan speed control (1x heating top / 1x heating bottom / 1x cooling section)
- Software control for fan speed regulation
- integr. cooling circuit and heat exchanger for connection to ext. Facility water supplies
- pyrolyse integrated
- manual conveyor width adjustment (electrical - inching operation)
- Passage direction left-right (operator side)
- flatscreen monitor and signal tower (three-coloured)
- PCB-width from 55- 536mm (with CBS 65- 536mm) Single Lane
- PCB-width from 2x70-250mm (with CBS 2x70-250mm) Dual Lane
- Rail 1 and 3 fixed, distance rail 7 to 3: 286mm
- PCB length max. 400mm (standard)
- with pin chain conveyor nickel plated (5mm standard)
- integrated Vacuum pump
- PC-control with Ethernet network-interface
- Stand-by modus
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- incl. transmission zone for finer adjustment of cooling gradient
- Basic color: SN 700 light basic
- Hoods front side / hoods bridge: RAL 7015 slate grey
- Rehm Analytics Recorder
- CE conformity

Vakuum Modul integriert in die inerte Prozesskammer (Text siehe SAP)

- Hand over speed of the upstream conveyor has to be identical to the transport speed of the oven (tolerance +/- 10 %)

VXC Nitro HK
Rehm Thermal Systems

VisionXC- Low cost Reflow Oven from Rehm Thermal Systems is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.

VXC nitro "Inert Reflow Soldering System" with...
- Pin Chain Conveyor nickel plated (pin length 3, 4 or 5 mm)
- PCB-widths from 50-508mm (with CBS 65-508mm)
- manual conveyor width adjustment (electrical - inching operation)
- top and bottom heating
- Fan Speed Regulation 1 included , heating Top
- integr. cooling circuit and heat exchanger for connection to ext. facility water supplies
- Flux Management , CZ MARS & Front FMS
- 1 pcs Gas Probe / Peak)
- flatscreen monitor ( Touch 23" )and signal tower (three-coloured) build-in
- Industrial PC-control with Ethernet-network-interface (RAID hard disk)
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- colour: SN700 (Light Basic)
- Hoods front side / hoods bridge: RAL 7015 (slate grey)
- CE conformity
- incl. transmission zone for finer adjustment of cooling gradient

VXP+ V3
Rehm Thermal Systems

VisionTripleX - Hibryd Reflow Oven from Rehm Thermal Systems is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.

VXP+ (V3) nitro Inert Reflow Soldering System with...
VXP+ nitro 3500 (Type 734), heating zone length 350mm, 4 cooling zones (V3)


- top and bottom heating
- fan speed control (1x heating top / 1x heating bottom / 1x cooling section)
- Software control for fan speed regulation
- integr. cooling circuit and heat exchanger for connection to ext. facility water supplies
- integrated pyrolyse system
- manual conveyor width adjustment (electrical - inching operation)
- flatscreen monitor and signal tower (three-coloured)
- PCB-width from 55-536mm (with CBS 65-536mm)
- with pin chain conveyor nickel plated 5 mm standard
- Industrial PC-control with Ethernet-network-interface
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- CE conformity
- incl. transmission zone for finer adjustment of cooling gradient
- Basic color: SN 700 light basic
- Hoods front side / hoods bridge: RAL 7015 slate grey
- Rehm Analytics Recorder
- Passage direction left to right

RPI TAS ProBot
KIC Thermal Electronic / Assembly / Reflow Oven

RPI TAS ProBot from KIC Thermal is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.