• Board Handling
  • Cleaning Systems
  • Component Placement & Insertion
  • Dispensing
  • Flux Management
  • Inspection SPI / AOI / Xray
  • Reflow Oven
  • Soldering
  • Solder Paste Printing
  • Accessories
LITE [SNAPCLEAN] Ultra Sonic Cleaning
MSTECH Europe
LITE [SNAPCLEAN] USC

The MSTECH SNAP CLEAN Ultrasonic Dry Cleaning (USC) System is a precision solution designed for removing fine dust particles without contact or liquids.
Using ultrasonic vibration generated from compressed airflow, this system gently lifts micro-particles from the surface and immediately removes them באמצעות vacuum suction.
Its high efficiency on very small particles (down to a few microns) makes it ideal for sensitive and flat substrates such as PCBs, films, and optical components.
The USC system delivers clean, damage-free surfaces without water, solvents, or drying steps—perfect for high-tech manufacturing environments.

Key Features
✅ Ultrasonic dry cleaning technology
✅ Removes micro-particles (3–100 µm)
✅ Non-contact process → no surface damage
✅ No chemicals, no water, no drying required
✅ Closed-loop system → no secondary contamination
✅ High efficiency on flat surfaces
✅ Inline integration compatible
✅ Optional HEPA filtration

LITE [SNAPCLEAN] TYPHOON
MSTECH Europe
LITE [SNAPCLEAN] TYPHOON
NON-CONTACT CLEANING -SYSTEM WITH IONIZED AIR

The MSTECH SNAP CLEAN Typhoon System is a high-performance non-contact dry cleaning solution designed to remove dust, particles, and static electricity from surfaces in industrial environments.
Using a high-speed rotating air nozzle combined with a vacuum extraction chamber, the Typhoon system creates a powerful and controlled airflow to detach and eliminate contaminants.
Its ability to clean complex shapes and uneven surfaces makes it particularly suitable for advanced manufacturing processes where traditional cleaning methods are insufficient.
This solution ensures clean, particle-free surfaces, improving quality and reliability in downstream operations such as bonding, coating, and printing.


Key Features
✅ Non-contact dry cleaning technology
✅ High-speed rotating nozzle for efficient dust removal
✅ Integrated vacuum suction system
✅ Removes static electricity (ion bar integration)
✅ Suitable for complex geometries and 3D parts
✅ Closed-loop cleaning system (no recontamination)
✅ Compatible with inline production
✅ Adjustable cleaning width (up to 560 mm)