MSTECH Europe
MST-[SNAPCURE] 395 L Gen7

UV LED Curing System, Controller: PLC + HMI, With UV sensor, With detection function( by voltage), without glass and Water Cooling,
Emitting window: 400x250mm, Wavelenght 395nm
395nm：1200mW/cm² (50mm)

MSTECH Europe
MST-[SNAPCURE] 395 XL Gen7

UV LED Curing System, Controller: PLC + HMI, With UV sensor, With detection function( by voltage), without glass and Water Cooling,
Emitting window: 500x400mm, Wavelenght 395nm
395nm：1200mW/cm² (50mm)

MSTECH Europe
MST-[SNAPCURE] 395 XXL Gen7

UV LED Curing System, Controller: PLC + HMI, With UV sensor, With detection function( by voltage), without glass and Water Cooling,
Emitting window: 600x600mm, Wavelenght 395nm
395nm：1200mW/cm² (50mm)

MSTECH Europe
MST-[SNAPCURE] UVC Multifrequence M

UV LED Curing System, Controller: PLC + HMI, 2 x Feane without glass Air Cooling
Emitting window: 125x100mm
235nm, 254nm, 275nm
around 20mW/cm2
3 wavelengths be controlled at the same time

MSTECH Europe
MST-[SNAPCURE] UVC Multifrequence L

UV LED Curing System, Controller: PLC + HMI, 2 x Feane without glass Air Cooling
Emitting window: 250x100mm
235nm, 254nm, 275nm
around 20mW/cm2
3 wavelengths be controlled at the same time

MSTECH Europe
MST-[SNAPCURE] UVC Multifrequence XL

UV LED Curing System, Controller: PLC + HMI, 2 x Feane without glass Air Cooling
Emitting window: 400x100mm
235nm, 254nm, 275nm
around 20mW/cm2
3 wavelengths be controlled at the same time

MSTECH Europe
MST-[SNAPCURE] UVC Multifrequence XXL

UV LED Curing System, Controller: PLC + HMI, 2 x Feane without glass Air Cooling
Emitting window: 600x100mm
235nm, 254nm, 275nm
around 20mW/cm2
3 wavelengths be controlled at the same time

Dimension: 5000 L x 1250 W x 1560 H
Pcb Dimension: Min: 50 L x 50 W / Max 405 W mm
Top/Bottom Max component height: 120 mm
Control System: PLC
Control Panel: Color Touch Screen
Operating System: Dedicated software real time operation
Tunnel composed of IR modules
Chain conveyor
Manual or auto adjustable conveyor width
USB port and LAN Port for loading and unloading profiles
Exahust OUTPUT
SMEMA Connected
Weight: 1600 Kg Approx

MSTECH Europe
LITE IR 2
Specification：
1. Maximum PCB Size: 740*510mm
2. Upper transmission height: 950±20mm Lower transmission height：350±20mm
3. Transmission method: Chain pin length 5mm
4. Maximum PCBA Height: ± 110mm
5. Control mode: touch screen + Panasonic PLC with network port
6. Rail fixing side: front rail
7. Heating zone: up 2/down 0 8.Signal Connection: SMEMA head
8. Dimension: 2000x1230x1400mm 10.Conveyor with auto type lifting door
9. There are 2 strips of LED lights on the door to show the status of the upper and lower boards.
10. CE standard electrical appliances and circuit design

Configuration：
1. Voltage: 3P 380V
2. Direction: Left to Right
3. Heating method: IR
4. Panasonic display

MSTECH Europe
LITE IR 3

Specification：
1. Maximum PCB Size: 740*510mm
2. Upper transmission height: 950±20mm
Lower transmission height：350±20mm
3. Transmission method: Chain pin length 5mm
4. Maximum PCBA Height: ± 110mm
5. Control mode: touch screen + Panasonic PLC with network port
6. Rail fixing side: front rail
7. Heating zone: up 4/down 0
8. Signal Connection: SMEMA head
9. Dimension: 3000x1230x1400mm
10. Conveyor with auto type lifting door
11. There are 2 strips of LED lights on the door to show the status of the upper and lower boards.
12. CE standard electrical appliances and circuit design

Configuration：
1. Voltage: 3P 380V
2. Direction: Left to Right
3. Heating method: IR
4. Panasonic display

MSTECH Europe
LITE [SNAPCLEAN] USC

The MSTECH SNAP CLEAN Ultrasonic Dry Cleaning (USC) System is a precision solution designed for removing fine dust particles without contact or liquids.
Using ultrasonic vibration generated from compressed airflow, this system gently lifts micro-particles from the surface and immediately removes them באמצעות vacuum suction.
Its high efficiency on very small particles (down to a few microns) makes it ideal for sensitive and flat substrates such as PCBs, films, and optical components.
The USC system delivers clean, damage-free surfaces without water, solvents, or drying steps—perfect for high-tech manufacturing environments.

Key Features
✅ Ultrasonic dry cleaning technology
✅ Removes micro-particles (3–100 µm)
✅ Non-contact process → no surface damage
✅ No chemicals, no water, no drying required
✅ Closed-loop system → no secondary contamination
✅ High efficiency on flat surfaces
✅ Inline integration compatible
✅ Optional HEPA filtration

MSTECH Europe
LITE IR 4

Dimension: 3900 L x 1250 W x 1560 H
Pcb Dimension: Min: 50 L x 50 W / Max 405 W mm
Top/Bottom Max component height: 120 mm
Control System: PLC
Control Panel: Color Touch Screen
Operating System: Dedicated software real time operation
Tunnel composed of IR modules
Chain conveyor
Manual or auto adjustable conveyor width
USB port and LAN Port for loading and unloading profiles
Exahust OUTPUT
SMEMA Connected
Weight: 1200 Kg Approx

MSTECH Europe

Specifications: Dimensions ：900*1180*1480mm, Voltage: AC220V, 50/60Hz , Weight Approx:400kg
UVLED Lamp 395 nm 500x400mm , 250mW/Cm2 at 60mm distance from subtrate

MSTECH Europe
LITE [SNAPCLEAN] TYPHOON
NON-CONTACT CLEANING -SYSTEM WITH IONIZED AIR

The MSTECH SNAP CLEAN Typhoon System is a high-performance non-contact dry cleaning solution designed to remove dust, particles, and static electricity from surfaces in industrial environments.
Using a high-speed rotating air nozzle combined with a vacuum extraction chamber, the Typhoon system creates a powerful and controlled airflow to detach and eliminate contaminants.
Its ability to clean complex shapes and uneven surfaces makes it particularly suitable for advanced manufacturing processes where traditional cleaning methods are insufficient.
This solution ensures clean, particle-free surfaces, improving quality and reliability in downstream operations such as bonding, coating, and printing.


Key Features
✅ Non-contact dry cleaning technology
✅ High-speed rotating nozzle for efficient dust removal
✅ Integrated vacuum suction system
✅ Removes static electricity (ion bar integration)
✅ Suitable for complex geometries and 3D parts
✅ Closed-loop cleaning system (no recontamination)
✅ Compatible with inline production
✅ Adjustable cleaning width (up to 560 mm)

MSTECH Europe
LITE PLUS SNAP VISION SNAP FLIP

Super-fast 2D AOI/ACI inspection
and image analysis with advanced
capabilities, including film thickness
measurement, for coating, dispensing,
component insertion, THT, and wave
soldering process lines.

MSTECH Europe
SMART INFINITY SMNAP FLIP SNAP VISION SNAP CURE

CONFIGURATION FLEXIBILITY
» [SNAPVISION][SNAPCURE][SNAPFLIP] inside.
» Multi-language 32’’ tactile HMI.
» No air supply required.
» Multi process sensors closed loop process.
» High resolution multi type inspection.
» 1D/2D barcode reading.
» Multi wavelength curing.
» Single lane capability up to 510 x 460 mm.
PRODUCTIVITY
» Inspection time less than 4 seconds/side.
» Curing time approx. 5 seconds/side.
» Flip less than 2 seconds.
FULL INTERCONNECTED TRACEABILITY (
OPTION)
OPTIMIZATION
→ Floor space & Energy efficient. Eco-friendly.
UNIQUE CONCEPT

MSTECH Europe
SEMI INFINITY

CONFIGURATION FLEXIBILITY
» [SNAPVISION][SNAPCURE] inside.
» Multi-language 32’’ tactile HMI.
» No air supply required.
» Multi closed-loop processor sensors.
» Fine pitch Datamatrix reading.
» ISO6 (Class 1000) / ESD Level 1 / Full CE / UL.
» Certification / Semi S2/S8 Compliant SECS.
» GEM ready / EMC / F47NPA79.
» Wavelenght controller and closed-loop.radiation.
PRODUCTIVITY
» Less than 2 seconds inspection time.
» Curing time under 5 seconds per tray.
FULL INTERCONNECTED TRACEABILITY (
OPTION)
OPTIMIZATION
» Floor space & Energy efficient. Eco-friendly.
UNIQUE CONCEPT

MSTECH Europe
LITE FLEX MULTILOADER AGV

The loading station LITE FLEX
MULTI LOADER is designed to
automatically feed PCBs into
an SMT production line or into
individual process machines
such as depaneling, soldering,
PCBA protection, backend, or test
systems. Adjustable for pcb size since S to XL.

MSTECH Europe
LITE FLEX MULTIUNLOADER AGV

PCBs are extracted from the
magazine by an extraction
mechanism and transferred onto
the handover conveyor. This
conveyor moves laterally on an
integrated shuttle to the handover
position, where the PCB is then
transferred to the next stage.

MSTECH Europe
LITE KIT 900 CHAIN

LITE KIT is an hyper-flexible,
cost-effective conveyor for PCB
transfer in SMT lines. Modular and
lightweight design enables easy
configuration, expansion, and
seamless integration.
600 mm
widths. Ensures smooth, stable,
and reliable product transfer
between processes.