VisionXP+ - High End Reflow Oven

VXP+ VAC
Rehm Thermal Systems

VisionXP+ - High End Reflow Oven from Rehm Thermal Systems is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.

VXP+ nitro 3850 (Type 734) VAC, heating zone length 350mm, 4 cooling zones, Single Lane

VXP+ nitro VAC Inert Reflow Soldering System with...
- continuous top and bottom heating
- fan speed control (1x heating top / 1x heating bottom / 1x cooling section)
- Software control for fan speed regulation
- integr. cooling circuit and heat exchanger for connection to ext. Facility water supplies
- pyrolyse integrated
- manual conveyor width adjustment (electrical - inching operation)
- Passage direction left-right (operator side)
- flatscreen monitor and signal tower (three-coloured)
- PCB-width from 55- 536mm (with CBS 65- 536mm) Single Lane
- PCB-width from 2x70-250mm (with CBS 2x70-250mm) Dual Lane
- Rail 1 and 3 fixed, distance rail 7 to 3: 286mm
- PCB length max. 400mm (standard)
- with pin chain conveyor nickel plated (5mm standard)
- integrated Vacuum pump
- PC-control with Ethernet network-interface
- Stand-by modus
- Vicon Software with Windows 11 IoT Enterprise LTSC 2024 (with RAID1-System)
- incl. transmission zone for finer adjustment of cooling gradient
- Basic color: SN 700 light basic
- Hoods front side / hoods bridge: RAL 7015 slate grey
- Rehm Analytics Recorder
- CE conformity

Vakuum Modul integriert in die inerte Prozesskammer (Text siehe SAP)

- Hand over speed of the upstream conveyor has to be identical to the transport speed of the oven (tolerance +/- 10 %)