Multi-core multi-function board tester.
High volumes. High quality. Low cost of test

Features

- 4x parallel test. Ultra-fast handling.
- No operator.
- Minimize the cost of test

Key Features

- 4x throughput with 4-Core Architecture
- No operator cost
- Ultra-fast handling in 3 sec.
- 5000+ tests/sec
- Automatic test program generation
- Parallel programming of different-type ICs
- Easy diagnostic of fixture’s pogo pins via mobile app

3030IL is the fully automatic bed-of-nails tester expressly designed to minimize the cost of test, providing unparalleled throughput without requiring the operator to load the PCB or perform the test. It can be quickly integrated into SMEMA production lines, or used with standard automatic board loaders/unloaders. Modular and fully upgradable, 3030IL combines a wide range of test capabilities in a unique, integrated, high-throughput, cost-effective system.

Zero-footprint board tester

Features
- Zero Footprint Design: maximize space & resources
- PC-independent Architecture
- The well-known 3030 series accuracy
- Easy to use: designed for untrained users

Key Features
- Zero Footprint Design
- Multi-Function Test Capabilities
- Ready to be integrated in any production line

Reduce the footprint to zero with SPEA 3030R In-Circuit tester. Designed to be integrated into third-party systems or 19” cabinet, or used manually with a minimum footprint. 3030R saves industrial floor and provides a comprehensive range of test capabilities to your production equipment, with unprecedented throughput.
Accuracy and full fault coverage are guaranteed: 3030R belongs to the SPEA 3030 series, which means 16-bit instrumentation, configurability and scalability according to your needs, and multiple test techniques integrated into a single test station.
Finally, integration into third-party systems brings more than space reduction: common elements such as mechanics and framework are spared, and the cost of test is further reduced.

Test Capabilities

- In-Circuit Test (Analog, Digital, Mixed)
- Power-On Test
- Functional Test
- Flashing via On-Board Programming
- Open Pin Scan
- Boundary Scan
- Built-In Self-Test
- Parametric Test

Multi-core inline-compatible board tester.
High throughput. High coverage.

Key Features
- True 2x Parallel Test
- Fixture compatible with 3030 Inline
- High-speed parametric ICT
- Automatic application development
- Multiple test functions
- Easy diagnostic of fixture’s pogo pins via mobile app

Fully compatible with 3030 Inline.

3030CE is the bed-of-nails tester designed to deliver a cost-effective manual test solution fully compatible with 3030 Inline testers. Fixture, presser and test program can be quickly and easily moved from 3030CE to 3030 Inline and vice versa, without mechanical adjustments. Modular and configurable, 3030CE provides 2x throughput compared with standard test solutions, thanks to its 2-Core Real Parallel Test. 3030CE delivers multiple test capabilities, guaranteeing 100% coverage in a unique, integrated, high-throughput, cost-effective system.

Features
- True Parallel Test
- Fixture & Test Program migration to 3030 Inline
- PC-independent Architecture
- Multi-device Parallel Flashing
- Precise contacting with SPEA’s receivers
- Hi-speed parametric ICT

Test Capabilities

Cost-effective Per-Pin Architecture
Each 3030CE channel is configurable by test program. Every nail can be used to perform any kind of test. This instrument/receiver 1:1 ratio guarantees several benefits: faster test generation, easy ECO management, full flexibility.

Open Pin detection
Two different test techniques, Electro Scan and Junction Scan, can be executed for detecting open pins and other process defects in an easy and fast way.

Functional test
3030CE testers provide not only functional test (FCT) at board level but also at cluster level. Programming is easy with Leonardo OS and by means of high-level languages such as Microsoft C ++, Visual Basic, LabView.

Fully upgradable & customizable
3030CE can be factory-equipped or upgraded on field with the instrumentation useful to satisfy the test requirements. It is possible to integrate power instrumentation (as programmable AC/DC generators, Active Loads, Power Matrix, programmable Power Supplies etc.) as well as third party instruments to increase test capabilities and throughput. Finally, 3030CE can accommodate a wide range of fixture receiver models, also from third parties (Genrad, Ingun, Zentel, Augat Pylon…).

Boundary Scan: test inaccessible parts
The Boundary Scan technique is able to test non-accessible nets and components. The simultaneous use of Boundary Scan technique with SPEA 3030CE ICT instrumentation allows to increase the test coverage reducing in the same time the fixture costs (virtual test points instead of real test nails).

Multi-core multi-function board tester

High throughput. High scalability.
Full test coverage

Key Features
· -75% test cost with True Parallel Test
· Multifunction: full test coverage
· Fully customizable & upgradable
· Equippable with power instrumentation
· Automatic test program generation
· Parallel programming of different-type ICs
· Easy diagnostic of fixture’s pogo pins via mobile app

Features
- 4 Test Cores. True Parallel Test
- Multi-device Parallel Flashing
- PC-independent Architecture
- Fully upgradable & customizable
- Forget field returns

Multifunction test capabilities:
100% coverage with 1 system
3030M is the multi-function, fully upgradable and customizable ICT tester, expressly designed to combine full test coverage and the lowest cost of test into a unique manual test equipment. Modular and configurable with a wide range of instrumentation and receivers, 3030M provides 4x throughput compared with standard testers.

SAVE MONEY – Why buy several testers when you just need one? By using 3030M, multiple test techniques are executed within a unique system. Compared to multiple test stations, benefits are huge: no operator, a single test program, reduced industrial space, faster training and lower operational costs.

SAVE TIME – Test time is greatly reduced by 3030M. First of all, expensive and unnecessary handling operations are avoided. With just one board loading/unloading the tester executes different tests in a optimized way, in order to avoid redundancy and over-test of your product, thus allowing you to save precious time. And what about programming multiple devices? With 3030M and Leonardo OS you just need a few minutes to generate your multi-function test program.

SAVE FIELD RETURNS – 3030M has been designed to help electronics manufacturers to boost their product quality. By executing various test techniques with the same tester used for ICT, all risks related to subsequent handling operations are avoided. At the end of the test the product is ready to be delivered to the final customer.

Test Capabilities

Boundary Scan: test inaccessible parts
The Boundary Scan technique is able to test non-accessible nets and components. The simultaneous use of Boundary Scan technique with SPEA 3030M ICT instrumentation allows to increase the test coverage reducing at the same time the fixture costs (virtual test points instead of real test nails).

Open Pin detection
Two different test techniques, Electro Scan and Junction Scan, can be executed for detecting open pins and other process defects in an easy and fast way.

Functional test
3030M testers provide not only functional test (FCT) at board level but also at cluster level. Programming is easy with Leonardo OS and by means of high level languages such as Microsoft C ++, Visual Basic, LabView.

Cost-effective Per-Pin Architecture
Each 3030M channel is configurable by test program. Every nail can be used to perform any kind of test. This instrument/receiver 1:1 ratio guarantees several benefits: faster test generation, easy ECO management, full flexibility.

Hi-speed parametric ICT
3030M hi-speed ICT parametric test is able to measure each single component value in a very short time. Advantages: programming time reduction (the test is automatically generated), test time reduction (microseconds of ICT test vs. milliseconds of FCT), repairing time reduction (automatic fault device identification).

Fixture & Test Program migration
SPEA Common Architecture allows Leonardo OS test programs to work with all SPEA board test systems, 3030 and even Flying Probers. You can quickly move your production from one system to another, depending on the production needs.

32x Ultra-High Parallelism In-Circuit Tester.

Full Parallel Test

SPEA T300 Board Tester is an unprecedented and unique architecture board test system that supports up to 32 parallel In-Circuit Test cores with additional capability of 256 cores for Flashing and Functional Test. This enables the T300 Asynchronous Parallel Architecture to perform tests and Flash in parallel up to 32 PCBAs (Printed Circuit Board Assemblies).
SPEA T300 bed of nails tester includes SPEA’s unique ICT-Plus test techniques which allow the detection of many defects present in electronics that are not detectable with traditional ICT testing.

Huge number of Test and Flashing in parallel

Most electronic printed circuit boards today are produced in panels composed of a high number of single boards (PCBAs), which in turn contain one or more components that need to be programmed.

The unique and unprecedented SPEA T300 bed of nails tester has been designed precisely to test and program a large number of boards in parallel or a large number of sections of a single big board. This enables high throughput and consequently very-low cost of testing and programming.

Programmable as Single or Dual Test Site. T300 can be programmed to operate as a Single Test Site or Dual Test Site.

- Single Test Site allows for testing of a single panel of boards for ICT, Flash Programming, and Functional test.
- Dual Test Site allows for testing of two panels of boards at the same time for ICT, Flash Programming, and Functional test. In order to double the throughput, the system is capable of performing a Split Test, such as, ICT in site 1 while simultaneously performing Flash Programming and/or Functional test on site 2.