• Board Handling
  • Cleaning Systems
  • Coating and Dispensing
  • Components Devices Programing
  • Component Insertion
  • Curing & Pre heating
  • Depaneling
  • In circuit test (ICT) & Test functional (FT).
  • Inspection AOI/ACI
LITE PLUS [SNAP VISION] [SNAP FLIP]
MSTECH Europe
LITE PLUS [SNAP VISION] [SNAP FLIP]

MULTI-PURPOSE
VISION SYSTEM FOR
INTEGRATION INTO
AN EXISTING LINE

Super-fast 2D AOI/ACI inspection
and image analysis with advanced
capabilities, including film thickness
measurement, for coating, dispensing,
component insertion, THT, and wave
soldering process lines.

Features :
■Resolution standard down to 40 um.
■Standard FOV up to 530 x 400 mm.
■Intuitive programming UI.
■Complete inspection time below
than 4 sec. (Depending on FOV).
■Traceability reading while inspection.
■Code Reading: DataMatrix, QR codes.
■UV traceable.
■Thickness trend capability.
■Light source: multi-LED illumination.
■No periodical calibration of camera needs.
■AI based diagnostic.
■Industry 4.0 MES/FIS
and data sharing.
LITE PLUS [SNAPVISION]
MSTECH Europe
LITE PLUS [SNAP VISION]

Super-fast 2D AOI/ACI inspection
and image analysis with advanced
capabilities, including film thickness
measurement, for coating, dispensing,
component insertion, THT, and wave
soldering process lines.
IMAGE MASTER 350PC - 3-axis robot
IMAGE MASTER 350PC - 3-axis robot
MUSASHI Engineering Europe Electronic / Backend / Inspection AOI/ACI

IMAGE MASTER 350PC - 3-axis robot from MUSASHI Engineering Europe is an industrial solution designed for electronics manufacturing environments. It supports reliable, repeatable production processes, helping improve quality, productivity and process control. Suitable for professional SMT, PCB assembly, inspection, material handling or related manufacturing applications depending on configuration.
SNAP VISION L SEMICONDUCTOR
MSTECH Europe
[SNAP VISION]

Multi-purpose vision engine for ultra-high speed inspection.

SNAP VISION L semiconductor.
In-line 2D Automated Optical Inspection (AOI) system for real-time quality control in production environments.
It can be integrated into MSTECH Europe units or third-party machines.

MODEL:
Inspection Area (FOV): 300 x 130 mm.
- Working Distance: 490 mm
- Resolution: 24 μm.
Application: High-resolution inspection for semiconductor and fine-feature detection in compact dual lane configurations.

VISION TECHNOLOGY:
- Intuitive programming UI.
- Typical inspection time: under 4 seconds, depending on the application.
- Coatings thickness trend verification.
- UV traceable.
- Light source: multi-LED illumination.
- No periodical camera calibration needed.
- AI based diagnosis.
- Proactive analysis engine.
- Industry 4.0 MES/FIS and Data sharing.
- Fixed inline AOI module
- Single or dual lane configuration.
- Industrial rigid structure for vibration stability.
- Precision optical alignment.
SNAP VISION XL - 530 x 400 mm
MSTECH Europe
[SNAP VISION]

Multi-purpose vision engine for ultra-high speed inspection.

SNAP VISION XL for large-format PCBA.
In-line 2D Automated Optical Inspection (AOI) system for real-time quality control in production environments.
It can be integrated into MSTECH Europe units or third-party machines.

MODEL:
Inspection Area (FOV): 530 x 400 mm.
- Working Distance: 860 mm
- Resolution: 40 μm.
Application: Large-format PCBA inspection (coating, marking, general AOI) with extended coverage.

VISION TECHNOLOGY:
- Intuitive programming UI.
- Typical inspection time: under 4 seconds, depending on the application.
- Coatings thickness trend verification.
- UV traceable.
- Light source: multi-LED illumination.
- No periodical camera calibration needed.
- AI based diagnosis.
- Proactive analysis engine.
- Industry 4.0 MES/FIS and Data sharing.
- Fixed inline AOI module
- Single or dual lane configuration.
- Industrial rigid structure for vibration stability.
- Precision optical alignment.