MSTECH Europe
LITE PLUS [SNAPLIGHT][SNAP FLIP]

MULTIFUNCTION LASER
WITH A UNIQUE EXTENDED
FOV, SUITABLE FOR
µMACHINING, SURFACE
PREPARATION, AND
DIGITAL SINTERING

The SNAP LIGHT module expands
the MSTECH software suite with a
high-precision laser system designed
for critical application in electronic &
semicon manufacturing. It performs
ultra- accurate ablation, marking,
sintering, cleaning, and edge-finishing
operations with full digital control.
SNAP LIGHT executes with
micrometric precision, ensuring
maximum efficiency, repeatability, and
reduced process errors.

Features
» Dimensions (WxDxH) : 900 x 1280 x 2148 mm
» INVERT PCBs (180º) FOR DOUBLE-SIDED PROCESS
» Laser spot: ≥ 40 μm.
» Marking area indicator.
» Internal barcode generator.
» Marca full graphics PC Software.
» Available as an OEM Kit or
within MSTECH Europe platform
compatible with SNAP MOTION, and
SMARTBOX and Process Tracker (optional)

MSTECH Europe
LITE 600 [SNAPACTIVE] Linear Atmospheric Plasma System

The MSTECH [SNAP ACTIVE] Linear Atmospheric Plasma System (LITE 600) is a compact, high-performance inline plasma solution designed to clean, activate, and prepare surfaces for advanced manufacturing processes.
Engineered for seamless integration into production lines, this system delivers uniform plasma treatment across wide surfaces, ensuring optimal adhesion, cleanliness, and process reliability.
Using advanced plasma technology, it effectively removes organic contaminants and modifies surface properties at low temperature, making it ideal for sensitive electronic and industrial applications.
With its compact footprint, reduced energy consumption, and real-time monitoring capabilities, the SNAP ACTIVE LITE 600 is the perfect solution for manufacturers looking to improve yield, quality, and process consistency.
👉 Ideal for high-precision industries such as electronics, semiconductor, automotive, and battery manufacturing.

Key Features

✅ Inline linear plasma system for continuous production
✅ Wide-area uniform plasma treatment
✅ Compact design (only 600 mm width) for easy integration
✅ Low-temperature plasma (<35°C) – safe for sensitive materials
✅ Advanced automatic power matching
✅ Real-time plasma intensity monitoring
✅ Built-in diagnostics: 12 failure alerts
✅ Digital interface for MES integration & traceability
✅ Energy-efficient (up to 25% power reduction)
✅ Compatible with multiple gases: N₂, O₂, Ar, CDA
✅CE
✅SEMI S2 / S8
✅ISO 7 Cleanroom (Class 10,000)

MSTECH Europe
LITE PLUS [SNAPMOTION] [SNAPACTIVE] Atmospheric TORCH Plasma

The MSTECH SNAP ACTIVE Atmospheric Torch Plasma System is a versatile and efficient solution for localized surface cleaning and activation.
Designed for targeted applications, this torch-based system delivers focused plasma treatment, allowing manufacturers to optimize surface preparation exactly where needed.
Its flexibility, ease of integration, and cost-efficiency make it a strong choice for manual, semi-automated, or inline processes.
The Atmospheric Torch system is ideal for companies seeking a simple yet powerful plasma solution to enhance adhesion, remove contaminants, and improve product quality.

⚙️ Features Tab
Key Features
✅ Torch-based plasma system for localized treatment
✅ Compact and flexible integration
✅ Ideal for manual or automated applications
✅ Precise treatment area control
✅ Low-temperature processing
✅ Fast startup and operation
✅ Compatible with various industrial gases
✅ Cost-effective solution for targeted applications

MSTECH Europe
LITE [SNAPACTION] Vaccum Plasma

The MSTECH LITE Vacuum Plasma System is a high-performance inline solution designed for precision surface treatment in controlled vacuum environments.
By generating plasma under low pressure, the system ensures uniform, repeatable, and highly controlled treatment, ideal for advanced applications such as microelectronics and semiconductor manufacturing.
It enables multiple processes including cleaning, activation, etching, and coating, significantly improving surface energy, adhesion, and product reliability.
With its compact footprint, inline automation, and high process stability, the LITE Vacuum Plasma system is perfect for high-quality industrial production.


Key Features
✅ Vacuum plasma technology for high precision
✅ Controlled low-pressure environment
✅ Uniform plasma distribution
✅ Inline automation with conveyor system
✅ Supports multiple gases (Ar, O₂, N₂)
✅ Integrated vacuum chamber and pump
✅ Advanced process control (PC-based)
✅ MES integration capability
✅ Compact footprint

MSTECH Europe
LITE [SNAPCLEAN] USC

The MSTECH SNAP CLEAN Ultrasonic Dry Cleaning (USC) System is a precision solution designed for removing fine dust particles without contact or liquids.
Using ultrasonic vibration generated from compressed airflow, this system gently lifts micro-particles from the surface and immediately removes them באמצעות vacuum suction.
Its high efficiency on very small particles (down to a few microns) makes it ideal for sensitive and flat substrates such as PCBs, films, and optical components.
The USC system delivers clean, damage-free surfaces without water, solvents, or drying steps—perfect for high-tech manufacturing environments.

Key Features
✅ Ultrasonic dry cleaning technology
✅ Removes micro-particles (3–100 µm)
✅ Non-contact process → no surface damage
✅ No chemicals, no water, no drying required
✅ Closed-loop system → no secondary contamination
✅ High efficiency on flat surfaces
✅ Inline integration compatible
✅ Optional HEPA filtration

MSTECH Europe
LITE [SNAPCLEAN] TYPHOON
NON-CONTACT CLEANING -SYSTEM WITH IONIZED AIR

The MSTECH SNAP CLEAN Typhoon System is a high-performance non-contact dry cleaning solution designed to remove dust, particles, and static electricity from surfaces in industrial environments.
Using a high-speed rotating air nozzle combined with a vacuum extraction chamber, the Typhoon system creates a powerful and controlled airflow to detach and eliminate contaminants.
Its ability to clean complex shapes and uneven surfaces makes it particularly suitable for advanced manufacturing processes where traditional cleaning methods are insufficient.
This solution ensures clean, particle-free surfaces, improving quality and reliability in downstream operations such as bonding, coating, and printing.


Key Features
✅ Non-contact dry cleaning technology
✅ High-speed rotating nozzle for efficient dust removal
✅ Integrated vacuum suction system
✅ Removes static electricity (ion bar integration)
✅ Suitable for complex geometries and 3D parts
✅ Closed-loop cleaning system (no recontamination)
✅ Compatible with inline production
✅ Adjustable cleaning width (up to 560 mm)