T300 Automatic Board Tester

32x Ultra-High Parallelism In-Circuit Tester.

Full Parallel Test

SPEA T300 Board Tester is an unprecedented and unique architecture board test system that supports up to 32 parallel In-Circuit Test cores with additional capability of 256 cores for Flashing and Functional Test. This enables the T300 Asynchronous Parallel Architecture to perform tests and Flash in parallel up to 32 PCBAs (Printed Circuit Board Assemblies).
SPEA T300 bed of nails tester includes SPEA’s unique ICT-Plus test techniques which allow the detection of many defects present in electronics that are not detectable with traditional ICT testing.

Huge number of Test and Flashing in parallel

Most electronic printed circuit boards today are produced in panels composed of a high number of single boards (PCBAs), which in turn contain one or more components that need to be programmed.

The unique and unprecedented SPEA T300 bed of nails tester has been designed precisely to test and program a large number of boards in parallel or a large number of sections of a single big board. This enables high throughput and consequently very-low cost of testing and programming.

Programmable as Single or Dual Test Site. T300 can be programmed to operate as a Single Test Site or Dual Test Site.

- Single Test Site allows for testing of a single panel of boards for ICT, Flash Programming, and Functional test.
- Dual Test Site allows for testing of two panels of boards at the same time for ICT, Flash Programming, and Functional test. In order to double the throughput, the system is capable of performing a Split Test, such as, ICT in site 1 while simultaneously performing Flash Programming and/or Functional test on site 2.