Ultra Sonic Cleaning

MSTECH Europe
LITE [SNAPCLEAN] USD

The MSTECH SNAP CLEAN Ultrasonic Dry Cleaning (USC) System is a precision solution designed for removing fine dust particles without contact or liquids.
Using ultrasonic vibration generated from compressed airflow, this system gently lifts micro-particles from the surface and immediately removes them באמצעות vacuum suction.
Its high efficiency on very small particles (down to a few microns) makes it ideal for sensitive and flat substrates such as PCBs, films, and optical components.
The USC system delivers clean, damage-free surfaces without water, solvents, or drying steps—perfect for high-tech manufacturing environments.

Key Features
✅ Ultrasonic dry cleaning technology
✅ Removes micro-particles (3–100 µm)
✅ Non-contact process → no surface damage
✅ No chemicals, no water, no drying required
✅ Closed-loop system → no secondary contamination
✅ High efficiency on flat surfaces
✅ Inline integration compatible
✅ Optional HEPA filtration