LITE PLUS [SNAPVISION] [SNAP FLIP]

MSTECH Europe
LITE PLUS SNAP VISION SNAP FLIP

MULTI-PURPOSE
VISION SYSTEM FOR
INTEGRATION INTO
AN EXISTING LINE

Super-fast 2D AOI/ACI inspection
and image analysis with advanced
capabilities, including film thickness
measurement, for coating, dispensing,
component insertion, THT, and wave
soldering process lines.

Features :
■Resolution standard down to 40 um.
■Standard FOV up to 530 x 400 mm.
■Intuitive programming UI.
■Complete inspection time below
than 4 sec. (Depending on FOV).
■Traceability reading while inspection.
■Code Reading: DataMatrix, QR codes.
■UV traceable.
■Thickness trend capability.
■Light source: multi-LED illumination.
■No periodical calibration of camera needs.
■AI based diagnostic.
■Industry 4.0 MES/FIS
and data sharing.