IO300

Metal Deposition
IOTech

Printed Electronics – ioTech Clad enabling digital PCB manufacturing
io300 - An Innovative Contactless Technology for High Resolution, High Speed
Metal Deposition

Corporate technological roadmaps require new manufacturing capabilities and technologies for metallization. Electronics materials are being deposited at always higher resolutions. Various solutions have been proposed, but these always require tradeoffs. Higher resolution requires custom materials, such as for inkjet, or hinder speed, such as in dispensing.



Ideally, we would have a digital additive solution that combines the throughput of traditional analog solutions, such as screen printing or plating, with the accuracy and flexibility of traditional digital solutions, such as jetting and needle dispensing. Also, the industry is seeking to improve sustainability, avoiding plating without reducing the conductivity functionality.



ioTech Clad technology offers a fully integrated process solution to print multi functional layers



Post CAD upload, the process can perform :

the conductive layers
the di-electric layers
the solder mask
solder paste deposition
via filling
digital vertical interconnections



In the CLAD technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This releases perfectly consistent drops of material onto the substrate below. The material drops can then be sintered or cured inline, in the same machine. High resolutions can be achieved as well as a very wide range of geometries and form factors. Process is fully material and substrate agnostic.



CLAD and its multiple benefits have been warmly welcomed by the industry, leading to multiple awards, highly regarded industrial investors, major semiconductor customers and prestigious co-funding from the European Union.