3D Wafer Bump & Wire Bonding AOI Inspection system
The Industry 4.0 Smart factory Solution
- Our technology has the ability to efficiently accumulate and aggregate examination data over a long period of time; it also constructs large amounts of data, and interprets the fundamental causes of failure through statistical methodology.
- By managing and controlling equipment to solve problems, we have implemented smart factory that has improved processes efficiently.
- Smart Factory was implemented based on big data analytics, multi-machine data communication, remote monitoring and control, and machine running.
SMARTRON (Remote Control and WEB control)
RMS(Remote Monitoring System) Menu
- Statistical Chart, Process Chart, Alarm History
- Remote View function PC remote control function
- Provide basic information of registered systems
- Provide all registered systems Yield, Worst, False calls, Product, Runtime.
- Provide Remote control feature to clear alarm with RMS
- Real-time Monitoring
- Provide Remote control feature for multiple systems
- Possible to monitor 36 systems
- Link-SPI-MOI-AOI Linkage
- Review-SPC Confirm
- Provide basic information such as Production amount,
Model, Pass rate of registered systems
Real-Time Process Management Quality Management Solutions
- Printer Net
– Closed Loop Solution with Screen Printer
- PEMTRON SPI & AOI Closed Loop Function
– Real-time defect conf irmation
- Mounter Net
– Closed Loop Solution with Mounter
– Bad Mark Mounter Sync and Adaptive Process Control
– Control a maximum of twelve on one monitor
- APC MFB
– Offset Technology of Mounting Location of Mounter, Using Data of AOI Inspection
▶ Highest quality 3D Wire-Inspection.
▶ With high-resolution, complete inspection is possible even
▶ Inspect Mirror-surface without Reflection problem.
▶ As for PEMTRON’S unique optical technology,
Coaxial lighting was applied to 3D installation.
▶ All Packages including
SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
▶ AOI + SPI Multi-Hybrid System.
▶ With high resolution quality, inspection of small and dense parts such as
Bump, Mini LED, parts lower than 009004, etc. are optimized.