X-eye NF120
Nano-focus X-ray
- Non-destructive analysis system for Wafer Level Packaging
- High-resolution image with Dual Type CTs
- TSV, Micro Bump, Pattern
Nano-focus X-ray Inspection System
Nano-focus Tube of 200 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
Wafer Bump Void
Wafer TSV Void
Applications
| X-ray Tube | 120 kV / 200 µA |
|---|---|
| Min. Resolution | 0.2㎛ |
| Table Size | 12inch wafer |
| Detector | 6 inch FPXD |
| CT Scan Method | Oblique CT / Cone beam CT |
| Foot print | 2,380 x 1,450 x 2,120 mm Control Box : 600 x 1,250 x 1,030 mm |
| Weight | 7,000kg |