HB75 Semiautomatic Die Bonder

The HB75 is a Bench Top Size Die Bonder, ideal for laboratories, pilot and small scale production lines. Easy operation with TFT Touch Screen and direct access and simple adjusment of all bond parameters.

  • Pick & Place

Pick Microchip from Die-Carrier and place it to your surface

  • Epoxy Dispensing

Simple and exact handling

  • Epoxy Stamping

Fast and precise stamping process

  • Rotation Bondhead

for Quick Change between tools

  • True vertical Z movement

Motorized Z-axis with 90° linear movement

  • Angle alignment

Microchip alignment thru the rotable work plate

  • Auto Vacuum Pump

integrated vacuum pump turns on automatically at Pick & Place.

  • optional heater stage

Up to 450 ° C heat, with programmable heating cycles