HB75 Semiautomatic Die Bonder
The HB75 is a Bench Top Size Die Bonder, ideal for laboratories, pilot and small scale production lines. Easy operation with TFT Touch Screen and direct access and simple adjusment of all bond parameters.
- Pick & Place
Pick Microchip from Die-Carrier and place it to your surface
- Epoxy Dispensing
Simple and exact handling
- Epoxy Stamping
Fast and precise stamping process
- Rotation Bondhead
for Quick Change between tools
- True vertical Z movement
Motorized Z-axis with 90° linear movement
- Angle alignment
Microchip alignment thru the rotable work plate
- Auto Vacuum Pump
integrated vacuum pump turns on automatically at Pick & Place.
- optional heater stage
Up to 450 ° C heat, with programmable heating cycles
