HB30 Heavy Wire Bonder

The HB30 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and pre-production runs and small scale production lines. Easy operation with TFT Touch Screen Operator System. Direct access and simple adjusment of all bond parameters and programs.

  • Aluminium & copper wedge bonding

Wire sizes from 100µm to 500µm Ribbon sizes up to 300×2000µm

  • Repeatable Loop Profiles

Motorised axis allows precise loop repetition

  • 6.5″ Touch Panel

6.5″ Touch Panel provides easy control

  • Automatic bond height adjustment

Z-axis sensor identifies touch down & sets height parameters

  • Simple Loop Programming

Create individual loop profiles consisting of up to 10 steps

  • Storage of 100 parameters

Storage & access of up to 100 parameter

  • Deep & Wide Bond Access

Ample work space due to special bond head design

  • High precision cutting sequence

Specific wire cutting parameters prevent substrate injury

  • Vacuum Stage Fixation

Optional function for high power applications

  • Extension Kit compatibility

Pick & Place and Video Targeting