HB30 Heavy Wire Bonder
The HB30 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and pre-production runs and small scale production lines. Easy operation with TFT Touch Screen Operator System. Direct access and simple adjusment of all bond parameters and programs.
- Aluminium & copper wedge bonding
Wire sizes from 100µm to 500µm Ribbon sizes up to 300×2000µm
- Repeatable Loop Profiles
Motorised axis allows precise loop repetition
- 6.5″ Touch Panel
6.5″ Touch Panel provides easy control
- Automatic bond height adjustment
Z-axis sensor identifies touch down & sets height parameters
- Simple Loop Programming
Create individual loop profiles consisting of up to 10 steps
- Storage of 100 parameters
Storage & access of up to 100 parameter
- Deep & Wide Bond Access
Ample work space due to special bond head design
- High precision cutting sequence
Specific wire cutting parameters prevent substrate injury
- Vacuum Stage Fixation
Optional function for high power applications
- Extension Kit compatibility
Pick & Place and Video Targeting
