HB16 Wire Bonder with motorized Z- & Y-Axis

The HB16 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Touch Screen and direct access and simple adjusment of all bond parameters.

  • Gold, aluminium, silver & copper wire

Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • Wedge, ball & ribbon bonding

Easy to switch between different bonding modes

  • Repeatable Loop Profiles

Motorised axis allows precise loop repetition

  • 6.5″ Touch Panel

6.5″ Touch Panel provides easy, intuitive control

  • Automatic bond height adjustment

Z-axis sensor identifies touch down & sets height parameters

  • Simple Loop Programming

Create individual loop profiles consisting of up to 10 steps

  • Storage of 100 parameters

Storage & access of up to 100 parameter sets

  • Deep & wide access

Ample work space due to special bond head design

  • Motorised Wire Clamp

Precise tail length control

  • Motorised Wire Spool

For consistent looping

  • Extension Kit compatibility

Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding