HB100 Automatic Wire Bonder

The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small volume productions. It performs wedge-and ball- bonding with one bond head. The HB100 is very easy to handle with touch-screen and joystick. The software strongly supports the user with process guidance and bond assist features. The bonding technology is based  on our popular semi-automatic bonders. It is completely engineered and manufactured in our German factory.

  • Automatic Wire Bonder

Motorized Z-X-Y Axis & Bondhead Rotation

  • Gold, aluminium, silver & copper wire

Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • 21″ Touch Screen

Touch Screen provides easy and quick control

  • Wedge, Ball & Ribbon bonding

One Bondhead. Easy to switch between different bonding modes

  • Simple Loop Programming

Create individual loop profiles

  • Deep & Wide Bond Access

Ample work space due to special bridge design