HB100 Automatic Wire Bonder
The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small volume productions. It performs wedge-and ball- bonding with one bond head. The HB100 is very easy to handle with touch-screen and joystick. The software strongly supports the user with process guidance and bond assist features. The bonding technology is based on our popular semi-automatic bonders. It is completely engineered and manufactured in our German factory.
- Automatic Wire Bonder
Motorized Z-X-Y Axis & Bondhead Rotation
- Gold, aluminium, silver & copper wire
Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm
- 21″ Touch Screen
Touch Screen provides easy and quick control
- Wedge, Ball & Ribbon bonding
One Bondhead. Easy to switch between different bonding modes
- Simple Loop Programming
Create individual loop profiles
- Deep & Wide Bond Access
Ample work space due to special bridge design
