HB10 Wire Bonder with motorized Z-Axis
The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT touchscreen, direct access and simple adjusment of all bond parameters.
- Gold, aluminum, silver & copper wire
Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm
- Wedge, ball & ribbon bonding
Easy to switch between different bonding modes
- 6.5″ Touch Panel
6.5″ Touch Panel provides easy control, intuitive
- Automatic bond height adjustment
Z-axis sensor identifies touch down & sets height parameters
- Storage of 100 parameters
Storage & access of up to 100 parameter sets
- Deep & wide bond access
Ample work space due to special bond head design
- Motorised Wire Clamp
Precise tail length control
- Motorised Wire Spool
For consistent looping
- Extension Kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding
