HB10 Wire Bonder with motorized Z-Axis

The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT touchscreen, direct access and simple adjusment of all bond parameters.

  • Gold, aluminum, silver & copper wire

Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • Wedge, ball & ribbon bonding

Easy to switch between different bonding modes

  • 6.5″ Touch Panel

6.5″ Touch Panel provides easy control, intuitive

  • Automatic bond height adjustment

Z-axis sensor identifies touch down & sets height parameters

  • Storage of 100 parameters

Storage & access of up to 100 parameter sets

  • Deep & wide bond access

Ample work space due to special bond head design

  • Motorised Wire Clamp

Precise tail length control

  • Motorised Wire Spool

For consistent looping

  • Extension Kit compatibility

Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding