HB05 Manual Wire Bonder

The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT display, direct access and simple adjusment of all bond parameters.

  • Gold, aluminum, silver & copper wire

Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • Wedge, ball & ribbon bonding

Easy to switch between bonding modes

  • Compact design & intuitive control

The bonder’s practical design ensures smooth and easy use

  • 4″ TFT display & push dial

Fast and easy control of all bonding parameters

  • Storage of 20 parameters

Easy setting recall for working on different applications

  • Deep & wide access

Ample work space due to special bond head design

  • Motorised Wire Clamp

Precise tail length control

  • Extension Kit compatibility

Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding