HB05 Manual Wire Bonder
The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT display, direct access and simple adjusment of all bond parameters.
- Gold, aluminum, silver & copper wire
Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm
- Wedge, ball & ribbon bonding
Easy to switch between bonding modes
- Compact design & intuitive control
The bonder’s practical design ensures smooth and easy use
- 4″ TFT display & push dial
Fast and easy control of all bonding parameters
- Storage of 20 parameters
Easy setting recall for working on different applications
- Deep & wide access
Ample work space due to special bond head design
- Motorised Wire Clamp
Precise tail length control
- Extension Kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding
