Spectrum S2-900

Spectrum II S2-900 Precision Fluid Dispensing System

The world-class precision and quality Spectrum II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs

“Dispensing underfill in-line with the Spectrum II reduces manual handling and gives a more uniform result, a more efficient SMD manufacturing process, and better yield.” – Mr. Elvin Solberg, Manufacturing Engineering Manager for ReSound

  • Consistent machine quality and reliability with the world’s preferred, fully-automated fluid dispensing system
  • High board density and minimal wet-out distances enabled by market-leading total system wet dispense accuracy
  • Production quality is assured by Nordson ASYMTEK’s patented closed-loop process controls
  • Reduce manufacturing costs with higher throughput from precision dual-simultaneous dispensing
  • Easily switch between multiple dispensing applications with the highly scalable, modular design

Nordson ASYMTEK continues to set the industry standard with the Spectrum II automated fluid dispensing system. ASYMTEK leverages over 30 years of experience with precision fluid delivery in the design refinements of the Spectrum II system to maximize their customers’ profitability with a small footprint, high productivity system that is also highly scalable and easily adapted to a wide variety of dispensing applications. The low mass, highly accurate motion system leads the market in achieving total system X-Y wet dispense accuracy and integrates precision Z-axis control to ensure consistent line widths when dispensing with single or dual simultaneous valves. Higher consistency leads to higher yield and higher yield leads to maximum profitability. New features and upgrade options for the Spectrum II systems continue to expand upon the wide range of applications. Whether it is dispensing underfill in PCBA applications, precise coating on mobile electronics and flexible circuits, solder paste sealing lines, or hot melt adhesive in case assembly applications, Spectrum II fluid dispensers are the globally preferred systems for mass production.


  • Calibrated Process Jetting (CPJ)
  • Non-Contact Height Sensor
  • Fids-on-the-Fly Software
  • Continuous Path Motion
  • Multiple Valve Types (Jets, Augers, Time-Pressure, etc.)
  • Multiple Applications (underfill, cavity fill, die attach, precision coating, encapsulation, hot-melt/PUR, and more)
  • Fluidmove® software
  • High-Resolution Monocle Vision Package- optional
  • Dual-Action Dispensing – optional
  • Dual-Simultaneous Dispensing;- optional
  • Tilt Dispensing: Single-Axis and Programmable Tilt + Rotate – optional
  • Dual-lane Dispensing for increased throughput – optional
  • Pre-/Dispense/Post-heating to enhance underfill flow-out and curing – optional
  • Class 100 cleanroom-compliant design – optional

Motion System
Z repeatability (1): ±15 μm (0.0006 in.), 3 sigma
X-Y repeatability (1): ±15 μm (0.0006 in.), 3 sigma
X-Y acceleration: 1 g peak
X-Y velocity: 1 m/s peak (40 in./s)
X-Y-Z encoder resolution: 1 μm
Wet Dispensing Accuracy & Repeatability
Single Applicator:
Cp ≥ 1.0: ±35 μm (0.0016 in.)
Cpk ≥ 1.0(1): ±40 μm (0.0016 in.)
Z-Gap Performance
Z-Gap Repeatability (2): ±15 μm (0.0006 in.), 3 sigma
Minimum Z-Gap Capability: 50 μm (0.002 in.)
Dispense Area (X-Y)
339 x 410 mm (13.3 x 16.1 in.)
Min. board/carrier width (3): 34 mm (1.3 in.)
Max. board/carrier thickness: 12 mm (0.5 in.)
Max. board/carrier length: One station: 340 mm (13.4 in.) Three stations: 320 mm (12.6 in.)
Min. board/carrier length: 25 mm (1.0 in.)
Max. board/carrier width: Single lane: 535 mm (21.1 in.) Dual lane: up to 228 mm (9.0 in.) (configuration dependent)
Facilities Requirements
System footprint: Single heat station: 600 mm wide x 1321 mm deep (23.6 x 52.0 in.) Two heat stations: 850 x 1321 mm (33.5×52.0 in.) Three heat stations: 1100 x 1321 mm (43.3×52.0 in.)
Air supply: Two air supplies: one with 3 CFM @ 100 psi for contact tooling, a second one with 1 CFM @ 100 psi for the rest of the system (100 psi = 689 kPa, 6.8 atm)
Power (mains): Power supply accommodates 200-240 VAC, 47-63 Hz single phase, 30 A
Note: System can run on 10V, 120 VAC without heater option installed.
Ventilation: Downdraft or updraft
System weight (4): 377-422 kg (830-930 lbs.)
(1) Wet dispense Cpk is tested against Nordson ASYMTEK standard sealant line path accuracy test method

(2) Z-gap repeatability is tested with Nordson ASYMTEK standard white ceramic, performance with other substrates may vary

(3) Contact factory regarding smaller boards/carriers

(4) System weight varies depending on configuration