
SFM3
3rd Generation Smart Flip Chip Machine
Realizes the world´s highest accuracy and productivity. Enhanced vision performance, High Accuracy, Precise bond force control, real time touch detection, temperature drift compensation, Flexibility, High UPH
2 Spindles/Head * 2 Gantry
Speed : 7.0 k UPH (Optimum)
Accuracy : ±5㎛@3δ
Die Size : ㅁ0.5 ~ ㅁ32mm
Die Thickness : Min. 40㎛
Wafer Size : up to 12″
Substrate Size
– 330(L) x 330(W)mm (1 Conveyor)
– 330(L) x 166(W)mm (2 Conveyor)
Dimensions : 1,681(W) x 1,460(D)
C2W, FOWLP