AP+ Automated Die Sorter
A new automated die sorter to handle the output mediums your process requires (carrier tape, waffle pack, Gel-Pak, JEDEC tray, film frame, grip ring, and custom trays). The AP+ can pick die from wafer, waffle pack, Gel-Pak, JEDEC tray, or custom tray using an input map, perform an optional 180 degree die flip, and place to output, while maintaining input to output traceability at the die level. With its multi-project (pizza map or reticle mask) wafer mapping capability and quick-change fixtures and tooling, this system gives you the highest level of flexibility while maintaining fast change over between processes to support low to medium volume, high mix environments.
Removable Taper
For placement to waffle pack, Gel-Pak, JEDEC tray, film frame, or custom tray, taper can be removed.
Vision System
For die perimeter targeting and centering with or without wafer mapping, ink dot detection, and die pick verification
Simple User Controls
All machine operation controlled by Royce’s Die Sort Manager software via touchscreen monitor (can be mounted on either side)
Optional Die Inverter
For 180 degree device flip prior to placement
Optimized Pick Arm
Integrates Royce’s unique floating flexure design to reduce contact force with a true Z-axis featuring programmable arm height for deep pocket access
Motorized Input Stage
For precise alignment of devices prior to die pick-up, accommodates up to 300 mm dia. Wafers
Vision System
For die perimeter targeting and centering with or without wafer mapping, ink dot detection, and die pick verification
Designed for Ease of Use
Easy reach front cover handle, side doors for input and output set-up, multiple EMO locations, visible tower light to alert operator to machine status, air and vacuum regulator and gauge on front panel, leveling feet to lift machine off castors for stability during operation
