REHM CondensoXC

Reliable processes with and without vacuum

In condensation reflow soldering with the CondensoX-Series, soldering is accomplished with the aid of a hot vapour as well as the medium Galden®. Since the heat transfer in condensation soldering is up to ten times higher than with convection soldering it is particularly suitable for handling large or high-mass boards. The use of a patented injection process and the flexible adjustment of temperatures and pressure allows the soldering procedure to be individually regulated. With the new CondensoXC Rehm increases its product range with a powerful system for laboratory applications, small lot sizes and prototyping.

An optional vacuum module ensures void-free soldering with all models of the CondensoXC – Series

Unique technology benefits

  • Injection principle (repeatable control of the reflow profile)
  • Hermetically sealed process chamber
  • Controllable vacuum process – pre-vacuum and vacuum after soldering possible
  • Manual loading from frontside
  • No Galden® loss, active Galden® filtering
  • Optional process monitoring (traceability) with the wireless WPS system

A patented principle for reliable and voidfree solder joints

The Condenso technology opens up much greater flexibility in the condensation soldering process
than is achievable through conventional methods. A more precise and wider range of reflow profiling
is made possible by using the injection technique and controlling both temperature and pressure

During condensation soldering, also known as vapour phase soldering, the latent heat released through the change of state from vapour to liquid is used to heat a component. The temperature always remains constant as the heat transfer fluid changes state (state transition). Through releasing heat during condensation, the vapour enables highly effective heat transfer to the solder. Furthermore, the maximum solder temperature is limited by the heat transfer fluid’s boiling point (Galden®), therefore preventing components from being damaged through overheating.

Our CondensoX-Series can solder even the most difficult assemblies quickly and dependably, at temperatures up to 260 °C. In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. The soldering process takes place in an enclosed process chamber. A vacuum module ensures void-free soldered joints – directly after the melting of the solder alloy or as a pre-vacuum. Our systems let you adjust all parameters, such as pressure or temperature, flexibly – for the best soldering results that exactly match the requirements of your manufacturing.

A patented principle with clear-cut advantages

A defined quantity of fluid (usually perfluorpolyether) is vaporized during operation in the process chamber, which is hermetically sealed by means of a bulkhead. The vapor allows for extremely effective heat transfer to the PCBs due to the release of heat during condensation. The temperature of the medium remains constant. In addition to this, the medium’s boiling point limits the maximum soldering temperature so that the PCBs cannot be damaged due to overheating. This, as well as the ability to control the volume of injected liquid and intermediate exhaust of the vapor, also makes it possible to precisely adjust the temperature/reflow profile of the PCB. Flawlessly reproducible soldering results are thus guaranteed, which increases process stability.

Efficient cooling

After the soldering process, the PCB can be advanced out of the process chamber for cooling. Here you’re provided with the option of reducing the standard air cooling temperature to a constant low level with the help of water. This makes it possible to cool the PCB absolutely uniformly, and above all more quickly. Furthermore, the machine’s ambient temperature is not significantly increased.

  • Standard: air cooling
  • Option: water cooling for quick and compliant cool-down

Medium recycling

A partial vacuum is generated when the vapor is drawn off, assuring quick drying of the PCBs. The vapor is cooled down after it has been drawn off. After it has condensed, it’s filtered and impurities are removed. The fluid is then returned to the soldering process. Due to the fact that the process chamber is hermetically sealed, only minimal loss results from vaporization during the soldering process. Medium consumption, as well as costs, are thus significantly reduced.

Advantages for your manufacturing process:

  • Hermetically sealed process chamber
  • Medium filtering and reuse
  • Drastically reduced medium consumption
  • Environmentally friendly and sustainable

Manual Loading with Workpiece Carrier

The CondensoXS is loaded from the front underneath the cooling. The workpiece carrier is advanced on a separate axis up to the housing, i.e. to the operator, where it can be removed and loaded. The maximum dimensions of the goods to be soldered are 650 x 650 x 95 mm. The workpiece carrier can be equipped with up to 6 lanes and has a fixed side-panel which serves as a starting point, as well as five adjustable crosspieces.

PCBs are transported strictly horizontally through the soldering system. The PCB is stationary during the vapor process. In this way, components cannot be shifted out of place while the solder is molten. This significant disadvantage of conventional vapor phase soldering systems, for which continuous vertical motion of the PCB is required during soldering, has been eliminated as a result. The scrap rate is reduced – along with your costs.

The advantages at a glance:

  • Horizontal conveyor
  • The PCBs are stationary during the entire process.
  • A high-speed handling system is available as an option.

Vacuum process for void-free solder joints

Void-free soldering with lead-free solders is an important prerequisite for the production of power electronics. However, minimal void rates are only possible with soldering processes during which the molten solder is subjected to a vacuum, making it easier for any remaining residues to escape from the solder joints. For this reason, the Condenso can be equipped with a vacuum pump upon request. This results in solder joints with surface contact ratios of greater than 99% in some cases.

In addition to the vacuum process during the melting phase, a vacuum can also be generated before the actual soldering process. This not only assures uniform injection of the Galden®, it also allows for outgassing of solvents from the solder paste. Moreover, the Condenso can replace the oxygen in the chamber with nitrogen thanks to the use of the pre-vacuum function. Oxidation problems are avoided as a result.

Optimized results thanks to vacuum!

There are lots of applications, for example in the field of component manufacturing for power electronics, in which low void rates are specified. However, such low void rates can only be realized with soldering processes by means of which the molten solder is subjected to a vacuum. This, as well, is no problem for the CondensoX product range – with just two additional steps: vacuum generation during the melting phase and an option for pre-vacuum prior to the actual soldering process, thus making it possible to achieve void-free solder joints in just five steps.

Just 3 steps to the creation of a profile – and just 5 for vacuum!

Profiling can be so easy! With Rehm’s CondensoX you only have to complete three steps in order to create an ideal profile for your PCB. Furthermore, you’re provided with endless profiling options, allowing you to further refine and adapt your profile depending on the PCB and the specified requirements.

As a rule, however, the following 3 steps are enough to arrive at your goal – the ideal temperature profile for your application:

  1. Injection of the Galden® | preheating of the PCB
  2. Injection of the Galden® | ideal soldering temperature
  3. Exhaust of the Galden® | cooling of the PCB

Reliable, reproducible solder joints

During the first step, the PCBs are preheated by injecting the Galden® by means of our patented injection process. The ideal soldering temperature is then achieved by injecting additional Galden® during the second step. Subsequently, the medium is exhausted from the process chamber and the PCB is cooled down during the third step – finished! Profiling can’t be any easier than this!

The results are reliable, reproducible solder joints!

Just 5 steps to vacuum!

Vacuum not only assures uniform injection of the Galden®, it also allows for outgassing of solvents from the solder paste. Vacuum during the melting phase makes it possible for gases still present in the solder paste to escape even better, thus providing for surface adhesion of greater than 98%.

  1. Pre-vacuum | uniform distribution of the Galden®
  2. Injection of the Galden® | preheating of the PCB
  3. Injection of the Galden® | ideal soldering temperature
  4. Vacuum during the melting phase | void-free solder joint
  5. Exhaust of the Galden® | cooling of the PCB

User-friendly software

Visu 2 includes process tools, remote maintenance and connection options for a barcode scanner. It features an intuitive user interface which considerably reduces the effort required for setup and operator training. Complete documentation can be accessed with just a few clicks. Visu 2 also provides password-protected administration with several access levels, language selection, data logging and maintenance reports.

WPS – Wireless Profiling

The wireless profiling system (WPS) is a temperature measuring system which can be used for wireless acquisition of the reflow profile without a separate power supply. Thermocouples and data loggers with tracking are thus rendered unnecessary. By means of the integrated evaluation unit and with the help of simple test PCBs, the temperature profile can be continuously monitored in an uncomplicated fashion and documented, e.g. for the substantiation of quality.

Additional Tools

  • Comprehensive online documentation
  • Multilingual software
  • Data logging
  • Import/export protocol
  • Maintenance protocol
  • Barcode interface
  • Process disabling
  • Remote maintenance