Solder Paste Inspection System
Pemtron’s color 3D solder paste inspection (3D SPI) device uses the latest color algorithm to produce images like the actual PCB.
Our 3D solder paste inspection (3D SPI) device allows for great convenience and accuracy for our customers.
Existing 3D image expresses the height as a color map.
However, the color 3D solder paste inspection (Color 3D SPI) connects 2D colored images with 3D measuring data to provide detailed and accurate 3D color images, making the operation of equipment much easier.
- Key Technologies
- Fast – 3D high speed inspection with the stripe pattern projection
- Reliable – 2D / 3D combined inspection Shadow Effect Prevention
- Accuracy – Automatic zero point setting
- Precise – Automatic warpage compensation by image recognition
- Technology – Composite color image processing Patent
- Ease of Use – Simple inspection recipe management & Programming in 5 minutes
Combination of 2D & 3D inspection eliminates common shadow
problem with SPI systems.
64 bit Windows 7 Operation System
Fast & Stable Operating System for high density PCB.
User Friendly Graphical Interface
Self-developed Gerber Editor controls the main functions on one page
which means it’s eliminating the effort of switching between multiple
screens. It is also possible to register or edit the data quickly and easily
by any users.
Color 3D SPI
Conventional SPI methods could only calculate heights above silk print
levels, but by using patented color enhancing algorithm TROI™ could
overcome these problems.
In addition, a fully rotational 3D view of the solder form is displayed.
This enables users to view a “life like’ image of the pad eliminating the
need to extract the board from the line to view the defect under a
Wider range of reference point search area prevents less deviation
of recognizing a zero reference point.
- Accurate height calculation
- Compare other pads within ROI
- Better repeatability
High Accuracy Linear Motor
The use of Linear X and Y stages, TROI™ provides a high accuracy under ±5μm.
High Speed & Performance
By improving the camera inspection speed, TROI™ show same
performance as single projection.
Gantry is a type of structure which allows the movement of the camera
head to shift into X/Y direction without moving the conveyor. It provided a highly stable and precise inspection platform.
Enhanced SPC System
SPC system analyses the defective data and controls the process problems or the production rate at a look. SPC data can be saved in a various file format such as HTML, Excel, Image and etc as users like.
Also with the enhanced SPC server function, data from multiple lanes can be controlled together or individually.