
The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submircon levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter
Automated Optical Inspection for Microelectronics
- Megapixel color imaging
- High magnification
top-down viewing camera - Quick set-up
- High speed
- High defect coverage
- Low false failure rate
Automated Inspection for
• Missing / damaged wires
• No stick / offpad
• Epoxy defects
• Die defects
• Bump / ball defects
• SMT defects
• Contamination
Nordson YESTECH’s advanced megapixel technology offers high-speed device inspection with exceptional defect coverage. With high resolution and telecentric optics,M1m inspects bond wires,die placement,SMT components and substrates,all within a footprint less than 1 sq. meter.The M1m can be put in-line with your wire bonders or off-line to support several bonders.
A magazine loader/unloader is available for off-line operations.
Programming the M1m is fast and intuitive.With CAD data input, a complete recipe can be completed in less than 1 hour*. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production.
The M1m utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes.Real-time color,normalized gray scale correlation,pattern matching and binary “blob”analysis are just a few of the tools used to automate the process.
Model
M1m Multi-function system with top-down viewing,
5 megapixel color camera
Inspection Capabilities
Throughput: 75-125 sq. mm / sec.
Maximum Inspection area: 350mm x 250mm x 25mm XYZ (14 x 10 x 1 in.)
Device Types: JEDEC, MCMs, Hybrids,FlipChip,BGA,microBGA,
MEMs,waffle packs
Defects Detected: Wires: missing,damaged,no stick,offpad,club foot,lifted
Die: missing,wrong,polarity,chipped,cracked,contamination
Part:position,missing,wrong,polarity,skew,tombstone
Epoxy:contamination,insufficient,excessive,bridging
Solder:contamination,insufficient,excessive,bridging
Software
Algorithms: Color,OCV,OCR,barcode recognition,both image and
rule-based algorithms
Data Requirements: ASCII Text,X-Y position,part #,ref.#,polarity
CAD Translation Package: Aegis,Unicam,Fabmaster,YESTECH CAD Utility
Operating System: Windows 7
Off-line Software: Optional – Rework,Review and Program Creation
SPC Software: Optional – Real-time local and remote
Hardware
Material Handling:SMEMA width conveyor, pass / fail signals,board clamping
Conveyor Length: 876mm (34.5 in.)
Conveyor Height: 950mm + /- 35mm (37.5 + /- 1.3 in.)
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imager: 5 megapixel color camera (1.15 to 9 micron pixel size)
Resolution 2448 x 2048; 3 micron pixel size standard
Optics: Proprietary high resolution,low distortion with
coaxial illumination
Magazine Loader / Unloader: Optional
Large FOV secondary Camera: O p tional
Facilities
Power: 100-240 VAC,50/60 Hz,10 amps
Air input: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
Footprint: 876mm x 1010mm x 1400mm (34.5 x 40 x 55 in.)
Weight: 770 kg (1700 lbs)