FX-940 ULTRA 3D AOI
Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Automated In-line 3D AOI System PCB Inspection
- 5 axis 3D NYT VISION Technology
- Advanced 2D + 3D inspection
- Multi-fringe digital projection
- 1 top-down and 4 side viewing cameras
- Automatic programming tools: < 30 minutes
- High defect coverage / low false failure
- PC data collection & reporting
Automated 3D Inspection for
• Co-planarity of chips, BGAs and other
height sensitive devices
• Solder defects / paste
• Lead defects / lifted leads
• Component presence and position
• Correct part / polarity
• Through-hole parts
Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
Advanced LED lighting and newly available image processing technology integrates several techniques, including 3D inspection, color inspection, normalized correlation and rule-based
algorithms, to provide complete inspection coverage with an unmatched low false failure rate.
Configurable for all line positions, the FX-940 ULTRA is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Model
FX-940 ULTRA 3D Multi-function system with top-down viewing,
4 side viewing cameras
2D + 3D Inspections
Specifications
Throughput: 130 cm2 /sec (2D) – 60 cm2 /sec (3D)
Maximum Board Size: 27.5” x 22” / 698mm (x) x 559mm (y)
Maximum Inspection Area: 22.5” x 18.5” / 571mm (x) x 470mm (y)
Clearance: 50mm top / 100mm bottom
Minimum Component Size: 008004 with high magnification sensor option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: shifted, missing, wrong, polarity, skew
tombstone, HiP, tilt, flip, billboard
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Other: FOD, SPI
Software
Algorithms: 3D body (x,y,z, theta, tilt), 3D solder profile, part, height,
part coplanarity, 3D lead inspection, color, OCR, OCV
barcode (1D & 2D), histogram, blob analysis, edge detection
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Off-line Software: Optional – Rework, Review and Program Creation
SPC Software: Optional – Real-time local and remote monitoring of first
pass yield, defect trends and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access
Hardware
Material Handling: SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping
Lighting: Multi-axis 4 phase LED
Conveyor: Dual lane conveyor, heavy duty chain conveyor,
large board option up to 1.5m
Facilities
Power: 110-220VAC, 50/60 Hz, 15 amps
Air input: 60 PSI min., 1/4” air hose, 2 CFM
Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight: 950 lbs (430 kg)