FX-940 AOI System

The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

Nordson YESTECH’s advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing

camera and four side viewing cameras, the FX-940 automated optical inspection system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.

Advanced Fusion Lighting and newly available 9 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

Configurable for all line positions, the FX-940 automated optical inspection system is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution

• Proprietary megapixel color imaging
• Capture on the fly technology
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage / low false failure
• Optional 3D inspection
Automated Inspection for:
• Solder defects
• Lead defects / lifted leads
• Component presence and position
• Correct part / polarity
• Through-hole parts
• Co-planarity of chips, BGAs and other height sensitive devices

FX-940 Multi-function system with top-down viewing,
Capture on the fly technology
Optional Upgrades: 4 side angle cameras
Digital Fringe Projection 3D Inspection
Throughput: Up to 30 sq. in./sec. > 1.5 million components per hour
Maximum Board Size: 20” x 21” (500mm x 525mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Algorithms: Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms. Optional 3D
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows 7
Off-line Software: Optional – Rework, Review and Program Creation
SPC Software: Optional – Real-time local and remote monitoring of first
pass yield, defect trends, and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access
Material Handling: SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imager: Up to 18 megapixel color camera sensor
25, 12 or 8 micron pixel size
Conveyor: Dual lane conveyor, heavy duty chain conveyor and 3 stage
Large Board Option Optional 48” x 21” (1219mm x 510mm)
Bottom Side Camera: Optional for bottom side bar codes
Board Supports: Bottom side
Power: 110-220VAC, 50/60 Hz, 15 amps
Air input: 60 PSI min., 1/4” air hose, 2 CFM
Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight: 950 lbs (430 kg)
Machine Installation: < 1 hour