Nordson YESTECH’s FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.

The new special warp compensation algorithm allows high speed compensation for warp on complex shapes contained within a field of view.

Solder Paste Inspection

  • High Accuracy at Fastest Speed
  • Full “on the fly” 3D solder paste metrology
  • Feedback, Feed Forward Ready (I 4.0)
  • Proprietary strobe lighting
  • Built in barcode reading for traceability
  • Intuitive software with touch screen programming

Automated 3D Inspection for

• Solder Paste Area coverage
• Solder Paste Volume
• Solder Paste Registration
• Solder Paste Bridge Detection
• Automated Defect Review
• SPC, barcode reading and archiving of board image with inspection results

The new improved ultrafast 3D sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the FX-500 ULTRA 3D SPI one of the fastest systems in the market.

The use of high speed “on the fly” inspection allows to minimize vibrations effects delivering greater accuracy and best in class repeatability.

Complementing Nordson’s line of optical and X-ray inspection systems, the FX-500 addresses industry 4.0 requirements and provides a valuable link to other Nordson Test and Inspection platforms.

FX-500 ULTRA 3D SPI Solder Paste Inspection
Optional Upgrades: SPC software, Barcode Readers (1D/2D), Programming
Software: ePM-SPI/AOI & GC-PowerPlace, Offline
Defect Review, Certification Target
Throughput: Up to 210 cm²/sec (32.5 in²/sec)
Maximum Board Size: 20.0 x 19.8 in. (508 x 503 mm)
Height Resolution: 0.2 μm (0.008 mils)
Field-of-View (FOV): 1.26 x 1.26 in. (32 x 32 mm)
X and Y Pixel Size: High Resolution: 15 μm (0.6 mils);
High Speed: 30 μm (1.2 mils)
Paste Height Range: 50 – 500 μm (2 – 20 mils)
Measurement Types: Height, Area, Volume, Registration, Bridge Detection,
Defect Review
Algorithms: 3D solder paste
Flexible circuit warp compensation algorithm
Programming Skill Level: Technician or operator
Operating System: Windows 7
SPC Software: Teach, Inspection, Defect Review and Real-time SPC
Machine Interface: SMEMA, RS232 & Ethernet
Height Accuracy: 2 μm on a Certification Target
Gage R&R: <<10%, 6 σ
Conveyor Speed Range: 150-450mm/sec. (5.9 – 17.7 in./sec
Conveyor Adjustment: Automatic
Power: 100 – 130 / 220 – 240V (10%), 50/60 Hz, 10 – 15 amps
Air input: 5.6 to 7.0 Kgf/cm² (80 to 100 psi @ 4 cfm)
Footprint: 39” x 52” x 60” (110 x 127 x 139 cm)
Weight: ~ 855 kg (1885 lbs.)
Machine Installation: < 1 hour