The BX AOI offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Nordson YESTECH’s advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. The optional four side viewing cameras add additional inspection capabilities found only on in-line systems.
Programming the BX is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The BX utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Programs created with the BX are also compatible with Nordson YESTECH’s complete line of AOI systems.
Advanced Fusion Lighting™ and newly available 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
The BX is equally effective for paste, pre / post-reflow and even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
• 5 megapixel color imaging
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage
• Low false failure rate
Automated Inspection for:
• Solder defects
• Lead defects
• Component presence and position
• Correct part / polarity
• Through-hole parts
• Paste
Model
BX Multi-function system with top-down viewing,
5 megapixel camera
Optional Upgrade: 4 side angle cameras
Inspection Capabilities
Throughput: Up to 10 sq. in./sec. > 500,000 components per hour
Maximum Board Size: 18” x 20” (457mm x 508mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
Defects Detected: Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Software
Algorithms: Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows 7
Off-line Software: Optional – Rework, Review and Program Creation
SPC Software: Optional – Real-time local and remote monitoring of first
pass yield, defect trends, and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access
Hardware
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imager: 5 megapixel color camera
Resolution 2448 x 2048; 25, 12 or 8 micron pixel size
Facilities
Power: 110-220 VAC, 50/60 Hz, 10 amps
Footprint: 34” x 39” x 17” (864mm x 991mm x 432mm)
Weight: 170 lbs (77 kg)
Machine Installation: < 1 hour