Novo™ 300
The Novo™ 300 offers exceptional value with superior process capabilities and is ideal for prototype, small batch production or cell manufacturing. The Novo™ 300 has many unique features, including drop-jet fluxing, IR preheating and selective soldering with fast and easy programming and machine setup.
Features and Benefits
- Standalone platform idea for prototype, cell manufacturing or small batch production requirements
- Entry level selective soldering with compact footprint requiring less than 1.1 square meters of factory floor space
- Full titanium solder pot compatible with all solder alloys plus easy tool-free maintenance
- Modular platform design allows options to be added as application needs change
- Entry level selective soldering system with capability to solder printed circuit boards at the same speed as larger or expensive machines
Versatility
With its compact form, single drop-jet fluxer and all titanium solder pot, the Novo™ 300 is a versatile selective soldering platform and has a soldering area of 300 x 300 mm. The Novo™ 300 can also process printed circuit boards as large as 500 x 300 mm (19.6 x 11.8 in.).
Novo™ 300 flux, preheat and soldering configuration
Value
With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
Motion System
Z accuracy ±50 μm (0.002 in.)
Z repeatability (1): ±50 μm (0.002 in.), 3 sigma
Z velocity: 0.05 m/s peak (2 in./s)
X-Y accuracy ±50 μm (0.002 in.)
X-Y repeatability (1): ±50 μm (0.002 in.), 3 sigma
X-Y velocity: 0.2 m/s peak (8 in./s)
Computer
PC with Windows® operating system
Software
PhotoScan “point-and-click” programming editor and
machine control software
Solder Pot Capacity and Weight
Capacity (2): Approx. 12.0 kg (26.4 lbs.)
Solderable Area (X-Y)
Max. 300 x 300 mm (11.8 x 11.8 in.)
Board Holder Capability
Max. board size (3): 500 x 300 mm (19.6 x 11.8 in.)
Board Clearance
Max. overboard clearance: 120 mm (4.7 in.)
Max. underboard clearance: 40 mm (1.5 in.)
Facilities Requirements
System footprint: 931 x 1235 mm (36.6 x 48.6 in.)
Compressed air: None required
Power (mains) (4): Power supply accommodates 1 phase,
230VAC, 50-60 Hz, 2 kW, 13 A without
preheater, or 3 phase, 400VAC, 50-60
Hz, 10 kW, 16 A with preheater
Nitrogen: 99.99% (4.0) pure, 4-6 bar, 1.3 m³/hour
Ventilation: Rear 150 m³/hour, 100 mm (4.0 in.) dia.
duct
System weight (5, 6): 350 kg (770 lbs.)
(1) Repeatability is measured at full rated system speed.
(2) Solder capacity and total weight of solder pot and
pump assembly varies depending on solder alloy.
(3) Contact factory regarding smaller or larger
boards/carriers.
(4) Electrical power varies depending on configuration.
(5) System weight varies depending on configuration.
(6) Configuration dependent. Other configurations may
be available. Contact Nordson SELECT.
Standard Features
MicroDrop drop-jet fluxer
Nitrogen preheating
All titanium solder pot and pump assembly
Quick change magnetically coupled solder nozzle
PhotoScan editor and machine control software
– Easy “point-and-click” programming
– Remote machine control
– Remote machine maintenance
– Network and FIS capability
TFT monitor
Optional Features
Solder frame for printed circuit boards
Topside infrared preheating
Process viewing camera
Automatic solder level sensing system
Wave height control sensing system
Automatic solder nozzle cleaning system
Flux level monitoring with information display
Data logging system with traceability of all process
parameters
Windows is a registered trademark of Microsoft
Corporation in the United States and other countries.
Standards Compliance
SMEMA, CE