Cerno™ 105IL
The Cerno™ 105IL is a robust selective soldering system delivering an exceptional combination of versatility, productivity and value. The Cerno™ 105IL has many unique features, including high speed Z-axis motion for faster processing time and reduced soldering cycle.
Features and Benefits
- Selective soldering of printed circuit boards as large as 914 x 711 mm (36.0 x 28.0 in.) with the included carriers
- Heavy duty non-SMEMA edge conveyor to support added weight of large backplanes, PCBs or tooling fixtures
- Interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys
- Choice of single selective solder nozzle, dual selective nozzles with independent control or 75 mm wide wave soldering nozzle
- SWAK-OS 4.0 graphics-based programming and machine control software enables fast and straightforward program creation
Flexibility
With its feature rich, graphics-based programming and machine control software, the Cerno™ 105IL is specially designed for demanding selective soldering applications. Set-up and time to first article is significantly reduced to within 10-15 minutes. The SWAK-OS 4.0 software features seamless fiducial recognition, live teach cameras, real time data collection, SQL backend data extraction and complete FIS capability for shop floor integration.
SWAK-OS 4.0 graphics-based programming software
Soldering Technology
With its flexible configuration, the Cerno™ 105IL is a versatile selective soldering system capable of processing tin-lead, lead-free or HMP solder alloys. Interchangeable solder pots and pumps are available with either single selective solder nozzle, dual selective nozzles with independent control or 75 mm (3.0 in.) wide wave soldering nozzle. The nitrogen inerted dual nozzle system enables the use of multiple size nozzles within the same program further enhancing flexibility and productivity.
Process Control
Nordson SELECT’s closed-loop rotary encoders and other advanced process control capabilities have been incorporated into the Cerno™ 105IL, enhancing solder quality, precision and yield capabilities.
Value
With a reputation for innovation, comprehensive process solutions from
Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
Motion System
Z accuracy ±50 μm (0.002 in.)
Z repeatability (1): ±50 μm (0.002 in.), 3 sigma
Z velocity: 0.15 m/s peak (6 in./s)
X-Y accuracy ±50 μm (0.002 in.)
X-Y repeatability (1): ±50 μm (0.002 in.), 3 sigma
X-Y velocity: 0.2 m/s peak (8 in./s)
Computer
PC with Windows® operating system
Software
SWAK-OS 4.0 graphics-based programming and machine
control software
Solder Pot Capacity and Weight
Capacity (2): Approx. 13.6 kg (30.0 lbs.)
Total weight of tin-lead solder together with solder pot and
pump assembly (2): Approx. 24.0 kg (53.0 lbs.)
Total weight of lead-free solder together with solder pot
and pump assembly (2): Approx. 21.3 kg (47.0 lbs.)
Solderable Area (X-Y)
Single bullet, dual bullet or mini-wave nozzles (3, 4):
Max.: 914 x 711 mm (36.0 x 28.0 in.)
Min.: 50 x 50 mm (2.0 x 2.0 in.)
Board Handling Capability
Heavy duty non-SMEMA edge conveyor (3):
Max. board/carrier length: 914 mm (36.0 in.)
Min. board/carrier length (4,5): 50 mm (2.0 in.)
Max. board/carrier width: 711 mm (28.0 in.)
Min. board/carrier width (4,5): 50 mm (2.0 in.)
Edge clearance (6): 20 mm (0.8 in.)
Load capacity (7): 22.7 kg (50.0 lbs.)
Optional SMEMA edge conveyor:
Max. board/carrier length: 914 mm (36.0 in.)
Min. board/carrier length (5): 50 mm (2.0 in.)
Max. board/carrier width: 711 mm (28.0 in.)
Min. board/carrier width (5): 50 mm (2.0 in.)
Edge clearance: 3 mm (0.12 in.)
Load capacity (7): 8.9 kg (19.5 lbs.)
Conveyor general:
Max. board/carrier thickness: 12.0 mm (0.5 in.)
Max. overboard clearance: 102 mm (4.0 in.)
Max. underboard clearance: 102 mm (4.0 in.)
Transport height: Conforms to SMEMA standard
for conveyor height; height
adjustable from 940-965 mm
(37.0 – 38.0 in.) from floor to
bottom of board
Operation modes (8): Automatic (SMEMA), manual or
pass-through
Facilities Requirements
System footprint: 2061 x 1716 mm (81.1 x 67.5 in.)
Air supply: 6-7 bar (90-100 psi)
Power (mains) (9): Power supply accommodates 208/220-
240VAC, 60 Hz single phase, 15 A
60 A with topside preheating
Nitrogen (10): 99.999% (5.0) pure, 4-7 bar (60-100 psi)
1.2 m3/hour consumption
Ventilation: 420 m3/hour recommended, two 100 mm (4.0
in.) dia. ducts
System weight (11,12): 570 kg (1250 lbs.)
(1) Repeatability is measured at full rated system speed.
(2) Solder capacity and total weight of solder pot and
pump assembly varies depending on solder alloy.
(3) Heavy duty non-SMEMA edge conveyor must use
supplied carrier for all board sizes.
(4) Substrates as small as 50 x 50 mm (2.0 x 2.0 in.) are
possible with the supplied carrier.
(5) Contact factory regarding smaller boards/carriers.
(6) Edge clearance of non-SMEMA edge conveyor does
not conform to SMEMA standards.
(7) Total weight of all parts on conveyor at any one time.
Contact factory regarding requirements for greater load
capacity.
(8) Machine is complaint with SMEMA height and
communications protocol.
(9) Electrical power varies depending on configuration.
(10) Nitrogen consumption is solder nozzle dependent and
machine configuration dependent.
(11) System weight varies depending on configuration.
(12) Configuration dependent. Other configurations may be
available. Contact Nordson SELECT.
(13) Leadtime and availability of optional SMEMA edge
conveyor to be determined at time of order.
Windows is a registered trademark of Microsoft
Corporation in the United States and other countries.
Standards Compliance
SMEMA (8)