Four-zone convection oven for group soldering SMD components on the surface of the printed circuit board

High-efficiency heating system that provides uniform heat transfer (±2℃);
Industrial PC and PID controller;
Modular design (ease of maintenance and repair);
Low noise engines with low vibration;
Self-diagnostic system with display of errors in the work and sound-light indication;
Rapid heating from room temperature to necessary (about 15 minutes);
Highly reliable solid-state relays.

Number of heating zones in the oven (top,bottom) – 4/4;
Total length of heating zones – 1400 mm;
Heating method – closed circuit circulation of hot air;
Number of cooling zones  – 1;
Cooling method – forced air flow;
Max PCB width – 300 mm;
PCB transportation height – 880 ± 20 mm;
Conveyor speed – 0 – 2000 mm/min;
Conveyor type – meshy;
Power supply – 3 phases, 380 V, 50/60 Hz;
Starting power – 20 kW;
Average operating power – 3 kW;
Heating time – 15 – 20 min;
Max heating temperature – 400ºC;
Temperature control accuracy – ±1ºC;
Average temperature deviation – ±2ºC;
Temperature adjustment – PID controller solid state relays;
Pneumatic pressure – 0,5 МPа;
Temperature control – deviation indication system;
Machine dimensions – 2500х700х1220 mm;
Machine weight: 300 kg.


Additional chain conveyor;
Control via PC.