The Integra™ 103ILD is a robust selective soldering system delivering an exceptional combination of versatility, productivity and value. The Integra™ 103ILD has many unique features, including dual independent X-Y gantries with two solder pots for faster processing time and reduced soldering cycle.
- Selective soldering of printed circuit boards as large as 610 x 457 mm (24.0 x 18.0 in.)
- Dual independent X-Y gantries with two solder pots for high-speed fluxing, preheating and selective soldering
- Interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys
- Choice of single selective solder nozzle, dual selective nozzles with independent control or 75 mm wide wave soldering nozzle
- SWAK-OS 4.0 graphics-based programming and machine control software enables fast and straightforward program creation
Flexibility
With its feature rich, graphics-based programming and machine control software, the Integra™ 103ILD is specially designed for demanding selective soldering applications. Set-up and time to first article is significantly reduced to within 10-15 minutes. The SWAK-OS 4.0 software features seamless fiducial recognition, live teach cameras, real time data collection, SQL backend data extraction and complete FIS capability for shop floor integration.
SWAK-OS 4.0 graphics-based programming software
Soldering Technology
With its flexible configuration, the Integra™ 103ILD is a versatile selective soldering system capable of processing tin-lead, lead-free, or HMP solder alloys.Interchangeable solder pots and pumps are available with either single selective solder nozzle, dual selective nozzles with independent control or 75mm (3.0 in.) wide wave soldering nozzle. The nitrogen inerted dual nozzle system enables the use of multiple size nozzles within the same program further enhancing flexibility and productivity.
Process Control
Nordson SELECT’s closed-loop rotary encoders and other advanced process control capabilities have been incorporated into the Integra™ 103ILD, enhancing solder quality, precision and yield capabilities.
Value
With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
Motion System
Z accuracy ±50 μm (0.002 in.)
Z repeatability (1): ±50 μm (0.002 in.), 3 sigma
Z velocity: 0.15 m/s peak (6 in./s)
X-Y accuracy ±50 μm (0.002 in.)
X-Y repeatability (1): ±50 μm (0.002 in.), 3 sigma
X-Y velocity: 0.2 m/s peak (8 in./s)
Computer
PC with Windows® operating system
Software
SWAK-OS graphics-based programming and machine
control software
Solder Pot Capacity and Weight
Capacity (2): Approx. 13.6 kg (30.0 lbs.)
Total weight of tin-lead solder together with solder pot and
pump assembly (2): Approx. 24.0 kg (53.0 lbs.)
Total weight of lead-free solder together with solder pot
and pump assembly (2): Approx. 21.3 kg (47.0 lbs.)
Solderable Area (X-Y)
Single bullet, dual bullet or mini-wave nozzles (3, 4):
Max. 610 x 457 mm (24.0 x 18.0 in.)
Min. 50 x 50 mm (2.0 x 2.0 in.)
Board Handling Capability
Max. board size: 610 x 457 mm (24.0 x 18.0 in.)
Min. board size: 50 x 50 mm (2.0 x 2.0 in.)
Conveyor
Max. board/carrier length: 610 mm (24.0 in.)
Min. board/carrier length: 50 mm (2.0 in.)
Max. board/carrier width: 457 mm (18.0 in.)
Min. board/carrier width (4): 50 mm (2.0 in.)
Max. board/carrier thickness: 7.6 mm (0.3 in.)
Max. overboard clearance: 102 mm (4.0 in.)
Max. underboard clearance: 102 mm (4.0 in.)
Edge clearance (5): 3 mm (0.12 in.), edge conveyor
including on-rail clamps
Transport height: Conforms to SMEMA standard
for conveyor height; height
adjustable from 940-965 mm
(37.0 – 38.0 in.) from floor to
bottom of board
Load capacity (6): 4.5 kg (10.0 lbs.)
Operation modes: Automatic (SMEMA), manual or
pass-through
Facilities Requirements
System footprint: 2768 x 1470 mm (108.9 x 57.8 in.)
Air supply: Less than 10 CFH @ 90-100 psi
Power (mains) (7): Power supply accommodates 208/220-
240VAC, 60 Hz single phase, 50 A
80 A with topside preheating
Nitrogen (8): 99.999% pure @ 60-100 psi, 30-60 CFH
consumption per solder pot
Ventilation: Rear 350 CFM recommended, four 100 mm
(4.0 in.) dia. ducts
System weight (9, 10): 613 kg (1350 lbs.)
(1) Repeatability is measured at full rated system speed.
(2) Solder capacity and total weight of solder pot and
pump assembly varies depending on solder alloy.
(3) Substrates as small as 50 x 50 mm (2.0 x 2.0 in.) are
possible without the need for fixturing or other tooling.
(4) Contact factory regarding smaller boards/carriers.
(5) Edge conveyor conforms to SMEMA standards.
(6) Total weight of all parts on conveyor at any one time.
Contact factory regarding requirements for greater load
capacity.
(7) Electrical power varies depending on configuration.
(8) Nitrogen consumption is solder nozzle dependent and
machine configuration dependent.
(9) System weight varies depending on configuration.
(10) Configuration dependent. Other configurations may be
available. Contact Nordson SELECT.
Windows is a registered trademark of Microsoft
Corporation in the United States and other countries.
Standards Compliance
SMEMA