Hesse BJ985

Bondjet BJ985 is characterized by several new features:

• Optimized pattern recognition (PR)
• Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
• Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency

Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. A bondhead change from aluminium to copper can be realized within minutes. In addition to a standard configuration Hesse offers automation concepts individually adapted for every application.

Advanced features and process advantages

• 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
• Improved wire handling: short distance between bondhead and spool
• Optimized pattern recognition: image capture with new digital image processing and flash
• Hesse Assist Tools (option):
  • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
  • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
  • Innovative bondtool detection
  • Wire spool detection
• Automated bondtool calibration without wedge gauge
• Precisely programmable bondforce actuator
• Loop generator for individualized loops
• Wear-free components with Piezo technology
• Maintenance-free solid state joints
• Pre-setting of bondheads via EEPROM

Flexibility:

• Working area BJ985: 370 mm x 870 mm (14.6″ x 34.3″)
• Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
• Maximization of throughput by automation (two/more parallel lanes)

Quality

• Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
• Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
• Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
• Integrated, non destructive pulltest for wire and ribbon

 Heavy wire bondheads

• Heavy wire and ribbon bondheads for Al, Cu and AlCu
• An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
• Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest

Various loop form functions

• Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
• Constant wire length and loop height
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application
• Individual loop shapes by configurable loop trajectory generator