Bondjet BJ980
Heavy Wire Wedge Bonder especially for solar and battery applications
The ultrasonic wedge-wedge bonder Bondjet BJ980 serves, with its most flexible and largest working area of 700 mm x 1132 mm, the growing demands for large-sized substrates, especially for solar and battery applications. The Bondjet BJ980 can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm with only one bondhead; Ribbons can be processed up to a size of 2000 µm x 400 µm.
Outstanding features are high speed and the largest bonding area in the industry. A change from aluminium to copper can be realized within minutes. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with non destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time.
Advanced Features and Process Advantages
- Largest working area in the industry: 700 mm x 1132 mm (27.6″ x 44.6″)
- 50 µm – 600 µm bondhead for Al, Cu, AlCu (2 mil – 24 mil)
- Ribbon up to 2000 µm x 400 µm (80 mil x 16 mil)
- Precisely programmable bondforce actuator: wire 2500 cN adjustable, Ribbon/Cu 5000 cN adjustable
- Pattern recognition time: 6 ms – 8 ms (Search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
- Rapid image capture with new digital image processing and flash light illumination
- E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
Quality
- Continuous real time monitoring of wire deformation, transducer current and -frequency within programmable control limits
- Process integrated Quality Control PiQC – integrated in Hesse Mechatronics‘ Workbench: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented)
- Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % safe on equipment
- Integrated, non-destructive pulltest for wire and ribbon
- BDE, traceability – integrated CSV-Logger or customized implementation
- SECS/GEM – standardized server connection for automation and communication
- MES – Interface to Manufacturing Execution Systems, integrated customized implementation
Speed
- Highest UPH due to linear motors
Working area
- X: 700 mm (27.6″);
Y: 1132 mm (44.6″); Z: 42 mm (1.65″) - P-Rotation: 440°
Cutting methods
- active, passive, air cut (for frontcut)
Ultrasonic
- Digital ultrasonic generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
- Ultrasonic Power Output : 100 W programmable
Wire
- Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil)
Ribbon
- Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)
(10 mil x 1 mil up to 80mil x 16 mil)
Machine dimensions
- 1280 mm x 2155 mm x 1822 mm (50.4″ x 84.4″ x 71.7″) (W x D x H, excl. monitor and light tower)
- Weight: approx. 3.000 kg
Media connections
- Gigabit-Ethernet (TCP/IP)
- Compressed air (high-purity)
- Vacuum
- 16A AC
- Digital IOs
- USB-Port
- SMEMA
Options
- E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- PiQC: Process integrated Quality Control by multi-dimensional signal analysis – integrated in Hesse Mechatronics‘ Workbench
- BDE, traceability – integrated CSV-Logger or customized implementation
- SECS/GEM – integrated standardized server connection
- MES – Interface to Manufacturing Execution Systems (customized)
Heavy Wire Bondhead HBK
- Type: HBK Frontcut and backcut
- Transducer: 60 kHz, optional 40 kHz
- Wire: Al, AlCu: 100 µm (4 mil) – 600 µm (24 mil)
- Bond Force: 2500 cN adjustable
- Wedge: 2.5″ for 60 kHz
Heavy Wire Bondhead RBK Ribbon
- Type: RBK Frontcut
- Transducer (bond frequency): 57 kHz
- Ribbon Dimensions:
Al: 250 µm x 25 µm to 2000 µm x 400 µm (Cu: 200 µm)
(10 mil x 1 mil to 80 mil x 16 mil) - Bonding force: 5000 cN adjustable
- Wedge length: 2.622″ for ribbon wedges
Heavy Wire Bondhead RBK Copper
- Type: RBK Frontcut
- Transducer (bond frequency): 57 kHz
- Wire: Cu: 125 µm – 500 µm (5 mil – 20 mil)
- Bonding force: 5000 cN adjustable