
Bondjet BJ955/BJ959
Fully Automatic Heavy Wire Wedge Bonder
Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.
Bondjet BJ955/959 are characterized by several new features:
- Optimized pattern recognition
- Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
- Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
Outstanding features are high speed and the largest bonding area. A change from aluminium to copper can be realized within minutes. The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity.
Advanced Features and Process Advantages
- 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
- Optimized pattern recognition: image capture with new digital image processing and flash
- Hesse Assist Tools (option):
- E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
- Automated bondtool calibration without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individual loops
- Wear-free components with Piezo-Technology
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
Flexibility
- Working area BJ955: 305 mm x 410 mm (12.0″ x 16.1″)
- Working area BJ959: 370 mm x 560 mm (14.6″ x 22.0″)
- Flexible use of the large working area, e.g. vacuum-clamping of several 5″ x 7″ standard DCBs
- Maximization of throughput by automation (two/more parallel lanes)
Quality
- Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented); as option
- Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
- Integrated, non-destructive pulltest for wire and ribbon
Heavy wire bondheads
- Heavy wire and ribbon bondheads for Al, Cu and AlCu
- An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
- Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non-destructive pulltest
Various loop form functions
- Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
- Constant wire length and loop height
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application
- Individual loop shapes by configurable loop trajectory generator
Working area
- BJ955: X: 305 mm (12″); Y: 410 mm (16.1″); Z: 42 mm (1.65″)
- BJ959: X: 370 mm (14.6″); Y: 560 mm (22.0″); Z: 42 mm (1.65″)
- P-rotation: 440°
Cutting methods
- active, passive, air cut (for frontcut)
Ultrasonics
- Digital ultra-sound generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
- Ultrasonic power output: 100 W programmable
Wire
- Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil)
Ribbon
- Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
(10 mil x 1 mil up to 80 mil x 16 mil)
Machine footprint
- BJ955: 740 mm x 1400 mm x 1912 mm (W x D x H, excl. light tower), appr. 1100 kg
- BJ959: 805 mm x 1550 mm x 1912 mm (W x D x H, excl. light tower), appr. 1250 kg
Media connection
- Compressed (high-purity)
- Vacuum
- 16A AC
- Digital IO´s
- USB-Ports
- SMEMA connection
- Gigabit-Ethernet (TCP/IP)
- Profibus support
Heavy Wire Bondhead HBK
- Type: HBK Froncut, Backcut
- Transducer (bond frequency): 60 kHz*
- Wire: Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil), application-dependent
- Bonding force adjustable
- Wedge length: 2.5″for 60 kHz
Heavy Wire Bondhead RBK Ribbon
- Type Ribbon: RBK Froncut
- Transducer (bond frequency): 60 kHz*
- Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
(10 mil x 1 mil up to 80 mil x 16 mil) - Bonding force adjustable
- Wedge length: 2.622″
Heavy Wire Bondhead RBK Copper
- Type Copper: RBK Froncut, Backcut
- Transducer (bond frequency): 60 kHz*
- Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
- Bonding force adjustable
- Wedge length: 2.733″