Bondjet BJ820
High Speed Fully Automatic Fine Wire Wedge Bonder
The Bondjet BJ820 is world‘s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:
- The highest bonding speed in the industry
- The largest working area
- The greatest axis accuracy
Advanced features and process advantages
- High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
- Precise bondforce control (static and dynamic)
- E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
- Wear-free components with Piezo technology
- Maintenance-free solid state joints
Flexibility
- Largest working area: 305 mm x 410 mm (12″ x 16″)
- Flexible use of working area, e.g. with a number of bonding stations (manual loading or with indexers)
- Universal software interface for indexer control
- Maximization of throughput by automation with two or more parallel lines
Speed
- Up to 7 wires per second, application-dependent, e.g. with 25 µm wire, 1 mm loop length, metallized wafer
Quality
- Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option
- PBS200 – server for central data management, for up to 20 Hesse wire bonders
- BDE, traceability – in PBS200 integrated XML interface or customized implementation
- SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
- MES: interface to Manufacturing Execution Systems, integrated or customized implementation
Piezo bondheads
- Bondhead 45°, 60° and 90° (deep access)
- Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
- Low maintenance costs
- Precise bondforce control (static and dynamic)
- Bondheads can be replaced in minutes
Working area
- X: 305 mm (12″); Y: 410 mm (16″)
- Z hub: 30 mm (1.2″)
- P rotation: 420°°
Mechatronic bondhead
- Bondhead 45°, 60°
- Bondhead 90° (deep access) for ribbon or wire
Frequency: 100 kHz*; alternative frequencies on request
Wire
- Al, Au, Ag, Cu, Pt: 12.5 µm – 75 µm** (0.5 mil – 3 mil)**
Ribbon
- Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm**
(1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
Fine wire wedge-wedge loop design
- Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
- Various loop form functions
- Constant wire length
- Constant loop height
- Individual loop shapes
- Fine pitch 40 µm inline, 25 µm staggered/dual line
(depending on wire and loop)
Machine dimensions
- Footprint: 722 mm x 1250 mm x 1800 mm (28.4″ x 49.2″ x 70.9″) (W x D x H, excl. monitor and light tower)
- Weight: approx. 1350 kg
Media connection
- Compressed air (high purity)
- Vacuum
- 16A/230V AC
- Digital IOs
- USB ports
- SMEMA connection
- Profibus support
Fine Wire Bondhead
- Type: BK Bondhead 45°
Option: BK Bondhead 60° - Frequency: 100 kHz*; alternative frequencies on request
- Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
Cu (in development): 50 µm (2mil) - Speed: Up to 7 wires per second, depending on:
- wire length
- wire size
- looping
- bondhead design (for 45° head only)
- Bonding force: 5 cN – 150 cN programmable
- Wedge length: 1″ (for all frequencies)
- Wear-free and low maintenance components with PIEZO-Technology
- Free programmable tail length, tear stroke and opening gap of wire clamp
- High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
- Precise bondforce control (static and dynamic)
- High mechanical stiffness of suspension helps eliminate undesired vibrations
Fine Wire Bondhead Deep Access 90°
- Type: DA Bondhead 90° (Deep Access)
- Frequency: 100 kHz*; alternative frequencies on request
- Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)
Ribbon: Al, Au: 6 µm x 35 µm (0.25 mil x 1.4 mil) µp to 25 µm x 250 µm (1 mil x 10 mil) - Wedge length: 1″ (for all frequencies), >1″ on request
- Immersion depth: 14 mm diving depth for bonding inside packages with 1″ wedge tool; optional 18 mm with 1.3″ wedge tool
- Deep access version for bonding ribbon and packages with access limitations
- Wear free and low maintenance components with PIEZO-Technology
- Free programmable tail length, tear stroke and opening gap of wire clamp
- Additional clamp above the transducer for optimized clamping force control
- High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
- Precise bondforce control (static and dynamic)
- Compact design reduces weight and moment of inertia allowing higher accelerations
- High mechanical stiffness of suspension helps eliminate undesired vibrations