The SQ3000-DD 3D Automated Optical Inspection (AOI) System is an extension of the award-winning SQ3000™ 3D AOI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCD widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.
Not only does the SQ3000-DD provide PCB flexibility, it also provides the flexibility to choose two of the same or two different proprietary MRS sensors, both of which meticulously identify and reject multiple reflections caused by shiny components and reflective solder joints. The new Ultra-High Resolution MRS sensor option provides an even finer resolution than the standard, delivering superior inspection performance ideally suited for 0201 metric and microelectronics applications where an even greater degree of accuracy and inspection reliability is critical. The unique architecture of both MRS sensor options simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.
- Flexibility at Its Best for Increased Throughput
With a smaller footprint than 2 SQ3000 standard systems, the dual lane, dual sensor SQ3000-DD features a smart conveyor design solution providing maximum flexibility to cater to varying PCB widths. This unique design gives you the convenience of inspecting different board sizes on different lanes or even switching from dual lane to single lane mode to inspect very large boards. With SQ3000-DD, you can also quickly inspect different programs on different lanes as well as perform synchronous or asynchronous inspection.
- High-Precision Accuracy powered by MRS Sensor Technology
SQ3000-DD offers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement making MRS an ideal technology for a wide range of applications including those with very high quality requirements.Choose between two of the same of two different MRS sensors – Standard, high-precision MRS sensor and/or the Ultra-High Resolution Sensors. The Ultra-High resolution sensor provides an even finer resolution than the standard, delivering superior inspection performance ideally suited for 0201 metric and microelectronics applications where an even greater degree of accuracy and inspection reliability is critical.
- Award-Winning Easy-to-Use Software
Powerful, yet extremely simple software designed with an intuitive interface reduces training efforts and minimizes operator interaction – saving time and cost.
| Inspection Capabilities | MRS Sensor | Ultra High Resolution MRS Sensor |
|---|---|---|
| Inspection Speed | 40 cm²/sec (2D+3D), Fast Sensor option 50 cm²/sec (2D+3D) |
15 cm²/sec (2D+3D) |
| Minimum Component SIze | 0402 mm (01005 in.) | 0201 mm (008004 in.) |
| PCB Size (Max.) | 350 x 330 mm (13.7 x 13 in.) | |
| Component Height Clearance | 50mm | |
| Imagers | Multi-3D sensors | |
| Resolution | Sub 10 µm | 7 µm |
| Image Processing | Autonomous Image Interpretation (AI²) Technology, Coplanarity and Lead Measurement | |