
The QX250i™ AOI system offers fast, flexible and high performance inspection for all applications and is ideally suited for pre-reflow and selective solder inspection. The top and bottom high-resolution Strobed Inspection Modules (SIMs) with enhanced illumination, provide a single platform for the inspection and defect review process that shortens the production line and drives ~50% productivity improvement.
AI² (Autonomous Image Interpretation) technology in the QX250i™ ensures ultrafast programming and is capable of getting you from zero to production ready in less than 13 minutes*. Powered by an 80 megapixel sensor, QX250i™ significantly improves solder joint and 01005 inspection performance and provides crisp images for more accurate defect review.
QX250i™ Specifications | |
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Board Width | Min. 50 mm (2 in.)/ Max. 308 mm (12 in.) |
Board Length | Min. 50 mm (2 in.)/ Max. 405 mm (16 in.) |
Resolution | 12µm pixel size (17µm for Qx200i) |
Inspection Speed | 110 cm2/sec |