CT3000

NFC, CPU, MEMORY, RFID Deviced Wafer Test
Highest Pin Count in ID devices Wafer Test

Up to 416 devices tested in parallel
Contact, contactless, dual-interface, NFC
Custom protocols supported
Parametric and functional test
Smart card device family suite editor

RFID Test
Capabilities

CT3000 RFID channels can perform, in parallel, extremely accurate and reliable measurements of impedance, retro modulation index, FDT Time. The channels perform the real time encoding and decoding of the communication protocol for the device under test.

Each channel is also equipped with a Controller, to decode in true parallel the communication protocol of the device under test, thus performing complete functional testing of the internal module structure.

The channels are also equipped with dedicated CPUs, wich permits a full programmability for testing customized protocols.

Test Frequency range is 125kHz to 15MHz (LF/HF).

Multi-Site
parallel test

CT3000 testers can test up to 416 synchronous or asynchronous devices in parallel, offering the highest pin count in testing RFID devices at wafer level (256 devices in parallel).

The system is docked to the wafer prober with hinge manipulator, offering a true zero-footprint solution together with the bene t of a direct, cable-less connection between the test resources and the device under test: best signal integrity is always guaranteed.

Asinchronous dedicated resources per device under test allows for true asynchronous test, with static or dynamic measurement per die.

Test Program generation and debug <1 day

– Easy-to-learn programming environment
– Guided Test Program generation
– The Automatic code generation
dramatically shortens the time taken to
develop, debug and release the program
– Automatic data import
– DUT-Oriented & Instrument-Oriented
instruction Libraries
– DUT Map
– Very Rapid Appllication Development
– Test Result Analyzer
– Shmoo Plot
– Easy to run. Easy to monitor.
Easy to mantain.

Test Capabilities

 

Open/Short/Leakage preliminary tests

In order to guarantee the reliability, consistency and reproducibility of the results, the CT3000 can perform preliminary tests such as open, short and leakage test, and verify if the contact is done correctly.

 

Test of passive devices

CT3000 can check the presence of passive devices, such as capacitors, resistors, resonators.

 

 

 

Impedance measurement

CT3000 can perform the accurate input device impedance measurement, before the veri cation of the smart card module communication signals when the RFID pads are contacted. In this way, it is possible to test the correct working of the device before assembling into cards, detecting faults not identi able at the  final test.

 

Signal clearness and strength

CT3000 can measure the retro modulation index, to evaluate the clearness and strength/quality of the answer signal provided by the component under test.

 

 

Ready to test all your smart card modules

CT3000 testers are open and con gurable to test any kind of communication protocols used on smart cards, and to be updated for new technologies. The systems can test devices based on the common standard protocols (as ISO 18000, EPC Global Gen 2, ISO 14443, ISO 15693, MIFARETM, DESFIRETM, FeliCaTM, ISO 11784/85, ICodeTM, HitagTM, ISO 7816), while they can perform functionality veri cations also by using customized protocols, completely de ned by the device manufacturer.

 

Single commands or command conditioning for RFID devices

 

CT3000 can verify the real working of RFID interface devices. The system is equipped with controller to read data and conditioning next write data to the devices, generating a full RFID test flow coverage.

No compromise – Short test time for ultra accurate measurementCT3000‘s latest-technology analog instrumentation combines test time reduction with extremely accurate measurements.

The DVM units are capable of data treatment and mathematical calculations on the acquired values. This ensures accurate measurements with no compromise in the data exchange either for single site or multi-site parallel measurements.