BGA Rework Sation C-5250T
Air flow and temperature is adjustable in a wide range to form high temperature breeze
The movable heating header is easy to operate; hot air header and mounting header are manually controlled; PCB sliding rack is micro-adjustable with X and Y axes
Color optical system with functions such as split vision, zoom in and micro-adjust, autofocus and menu operation, and with aberration detecting device
Color LCD monitor;
Touch screen interface, PLC control; able to display temperature curves and two detecting curves at the same time;
Two independent heating areas, temperature and time are digital displayed;
Over-heating protection for the hot air heating header; temperature of hot air in the upper and infrared in the bottom is program controllable; with 6 segments of temperature up (down) and 6 segments constant temperature control, 20 groups of temperature curve are stored; Cruve analysis can be carried out on the touchscreen and has the communication function as computers ,with software attached; with temperature measurement function;
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area;
Suction force of the in-build vacuum pump is adjustable; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
Over-heating protection for the upper hot air heating header;
Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep solder effect; heating board is independent controlled;
With different Ti alloy hot air nozzles (customizable), easy to replace
PCB Dimension:
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W20×D20 – W300×D400mm
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PCB Thickness:
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0.5 – 3mm
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Working Table Adjustment:
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±10mm forward /backward, ±10mm left/right
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4. Temperature Control:
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K-type thermocouple, close cycle controlled
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5. Bottom Pre-heater:
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Far infrared, 3000W
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6. Nozzle heater:
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hot air, 500W
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7. PCB locating way:
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Outer or Jig
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8. Power supply:
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AC220V, 50/60Hz, 3.5KVA
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9. Machine Dimension:
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L700 × W650 × H800mm
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10. Weight: 120kg
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