RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and shiny solder joints. RMA258-15R is capable of exceptional reflow during long, hot profiles. RMA258-15R leaves medium, amber colored post process residues. Available in tin/lead and lead-free, including no- and low-silver alloys.

– Long Pause-to-Print Capabilities
– Enhances Fine Print Definitions
– No Head-in-Pillow
– Excellent Wetting, Even Leadless Devices
– Exceptional Reflow During Long, Hot Profiles
– Reduced Voiding
– Available in Industry Standard Sizes
Do not add used paste to unused paste.
Store used paste separately; keep unused paste tightly sealed with internal plug or end cap in place.
After opening, solder paste shelf life is environment and application dependent