NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits.
– Designed for MyData MY500 Jet Printer
– Clear Pin-Probe Testable Residue
– Excellent Wetting, Even Leadless Devices
– Reduces Voiding Under Micro-BGAs
– 12-14 Hour Tack Time
– Vapor Phase Compatible
Handle exactly as noted for best performance.
Allow the solder paste to warm up completely and naturally to ambient
temperature prior to use. From-18°C (0°F)- approximately 12 hours.
From 0°Cto 12°C (32°F-55°F)-approximately 4 hours.
After opening, solder paste shelf life is environment
and application dependent.
Daily replacement with a fresh syringe of paste can prolong ejector life and optimize performance.